Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10797016 | Method for bonding semiconductor chips to a landing wafer | Eric Beyne, Giovanni Capuz | 2020-10-06 |
| 10192009 | Simulation of photovoltaic modules | Hans Goverde, Francky Catthoor, Jef Poortmans, Christiaan Baert | 2019-01-29 |
| 9978710 | Method for self-aligned solder reflow bonding and devices obtained thereof | Eric Beyne, Jaber Derakhshandeh | 2018-05-22 |
| 9799632 | Method for aligning micro-electronic components | Ingrid De Wolf, Eric Beyne | 2017-10-24 |
| 9601459 | Method for aligning micro-electronic components | Ingrid De Wolf, Eric Beyne | 2017-03-21 |