Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11362061 | Method for the electrical bonding of semiconductor components | Lin Hou, Jaber Derakhshandeh, Eric Beyne, Ingrid De Wolf | 2022-06-14 |
| 10797016 | Method for bonding semiconductor chips to a landing wafer | Vikas Dubey, Eric Beyne | 2020-10-06 |