| 12412854 |
Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same |
Linghan Chen |
2025-09-09 |
| 12347804 |
Bonded assembly including interconnect-level bonding pads and methods of forming the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani, Rahul Sharangpani |
2025-07-01 |
| 12261227 |
Thin film transistor, display substrate and display device with reduced leakage current |
Chenglong Wang, Yezhou Fang, Feng Li, Lei Yao, Lei Yan +6 more |
2025-03-25 |
| 12125814 |
Bonded assembly containing different size opposing bonding pads and methods of forming the same |
Peter Rabkin, Masaaki Higashitani |
2024-10-22 |
| 12026503 |
Device of updating library required by testing program for testing and method thereof |
— |
2024-07-02 |
| 11948902 |
Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same |
Peter Rabkin, Adarsh Rajashekhar, Raghuveer S. Makala, Masaaki Higashitani |
2024-04-02 |
| 11869877 |
Bonded assembly including inter-die via structures and methods for making the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2024-01-09 |
| 11791278 |
Display substrate motherboard and manufacturing method thereof, display substrate and display apparatus |
Lei Yao, Feng Li, Lei Yan, Kai Li, Chenglong Wang +2 more |
2023-10-17 |
| 11710747 |
Array substrate, manufacturing method thereof, and display device |
Fang Yan, Dawei Shi, Lei Yao, Zifeng Wang, Wentao Wang +6 more |
2023-07-25 |
| 11646282 |
Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same |
Peter Rabkin, Masaaki Higashitani |
2023-05-09 |
| 11646283 |
Bonded assembly containing low dielectric constant bonding dielectric material |
Peter Rabkin, Masaaki Higashitani, Ramy Nashed Bassely Said |
2023-05-09 |
| 11637134 |
Array substrate, method for manufacturing the same, and display device |
Jinjin Xue, Dawei Shi, Feng Li, Lei Yao, Wentao Wang +5 more |
2023-04-25 |
| 11562975 |
Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the same |
Peter Rabkin, Masaaki Higashitani |
2023-01-24 |
| 11547943 |
Providing social network content in games |
Jinming Cao, Chao Guo, Xingguang Yu, Huiqiang Liu, Kerry Yang +1 more |
2023-01-10 |
| 11448929 |
Array substrate with light shielding metal portions and manufacturing method thereof, display device |
Lei Yao, Dawei Shi, Wentao Wang, Lu Yang, Haifeng Xu +8 more |
2022-09-20 |
| 11424215 |
Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2022-08-23 |
| 11398092 |
Parking detection method and device based on visual difference |
Jun Yan |
2022-07-26 |
| 11362061 |
Method for the electrical bonding of semiconductor components |
Jaber Derakhshandeh, Eric Beyne, Ingrid De Wolf, Giovanni Capuz |
2022-06-14 |
| 11348901 |
Interfacial tilt-resistant bonded assembly and methods for forming the same |
Peter Rabkin, Yangyin Chen, Masaaki Higashitani |
2022-05-31 |
| 11121226 |
Thin film transistor and method for manufacturing the same, array substrate and display device |
Lei Yan, Feng Li, Yezhou Fang, Jun Fan, Lei Li +6 more |
2021-09-14 |
| 11031419 |
Array substrate, method for manufacturing the same, and display device |
Jinjin Xue, Dawei Shi, Feng Li, Lei Yao, Wentao Wang +5 more |
2021-06-08 |
| 10795228 |
Array substrate with diffuse reflection layer, method for manufacturing the same, and display device comprising the same |
Lei Yao, Dawei Shi, Wentao Wang, Lu Yang, Haifeng Xu +8 more |
2020-10-06 |
| 10275978 |
Coin-operated washer/dryer |
Kun YANG, Yiping Bian, Gongfa Ma, Bin Zhang |
2019-04-30 |
| 9844728 |
Providing social network content in games |
Jinming Cao, Chao Guo, Xingguang Yu, Huiqiang Liu, Kerry Yang +1 more |
2017-12-19 |
| 8974188 |
Blade clip |
— |
2015-03-10 |
