Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412854 | Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same | Linghan Chen | 2025-09-09 |
| 12347804 | Bonded assembly including interconnect-level bonding pads and methods of forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani, Rahul Sharangpani | 2025-07-01 |
| 12261227 | Thin film transistor, display substrate and display device with reduced leakage current | Chenglong Wang, Yezhou Fang, Feng Li, Lei Yao, Lei Yan +6 more | 2025-03-25 |
| 12125814 | Bonded assembly containing different size opposing bonding pads and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2024-10-22 |
| 12026503 | Device of updating library required by testing program for testing and method thereof | — | 2024-07-02 |
| 11948902 | Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same | Peter Rabkin, Adarsh Rajashekhar, Raghuveer S. Makala, Masaaki Higashitani | 2024-04-02 |
| 11869877 | Bonded assembly including inter-die via structures and methods for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2024-01-09 |
| 11791278 | Display substrate motherboard and manufacturing method thereof, display substrate and display apparatus | Lei Yao, Feng Li, Lei Yan, Kai Li, Chenglong Wang +2 more | 2023-10-17 |
| 11710747 | Array substrate, manufacturing method thereof, and display device | Fang Yan, Dawei Shi, Lei Yao, Zifeng Wang, Wentao Wang +6 more | 2023-07-25 |
| 11646282 | Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2023-05-09 |
| 11646283 | Bonded assembly containing low dielectric constant bonding dielectric material | Peter Rabkin, Masaaki Higashitani, Ramy Nashed Bassely Said | 2023-05-09 |
| 11637134 | Array substrate, method for manufacturing the same, and display device | Jinjin Xue, Dawei Shi, Feng Li, Lei Yao, Wentao Wang +5 more | 2023-04-25 |
| 11562975 | Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2023-01-24 |
| 11547943 | Providing social network content in games | Jinming Cao, Chao Guo, Xingguang Yu, Huiqiang Liu, Kerry Yang +1 more | 2023-01-10 |
| 11448929 | Array substrate with light shielding metal portions and manufacturing method thereof, display device | Lei Yao, Dawei Shi, Wentao Wang, Lu Yang, Haifeng Xu +8 more | 2022-09-20 |
| 11424215 | Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-08-23 |
| 11398092 | Parking detection method and device based on visual difference | Jun Yan | 2022-07-26 |
| 11362061 | Method for the electrical bonding of semiconductor components | Jaber Derakhshandeh, Eric Beyne, Ingrid De Wolf, Giovanni Capuz | 2022-06-14 |
| 11348901 | Interfacial tilt-resistant bonded assembly and methods for forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2022-05-31 |
| 11121226 | Thin film transistor and method for manufacturing the same, array substrate and display device | Lei Yan, Feng Li, Yezhou Fang, Jun Fan, Lei Li +6 more | 2021-09-14 |
| 11031419 | Array substrate, method for manufacturing the same, and display device | Jinjin Xue, Dawei Shi, Feng Li, Lei Yao, Wentao Wang +5 more | 2021-06-08 |
| 10795228 | Array substrate with diffuse reflection layer, method for manufacturing the same, and display device comprising the same | Lei Yao, Dawei Shi, Wentao Wang, Lu Yang, Haifeng Xu +8 more | 2020-10-06 |
| 10275978 | Coin-operated washer/dryer | Kun YANG, Yiping Bian, Gongfa Ma, Bin Zhang | 2019-04-30 |
| 9844728 | Providing social network content in games | Jinming Cao, Chao Guo, Xingguang Yu, Huiqiang Liu, Kerry Yang +1 more | 2017-12-19 |
| 8974188 | Blade clip | — | 2015-03-10 |