Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412854 | Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same | Lin Hou | 2025-09-09 |
| 11990413 | Three-dimensional memory device including aluminum alloy word lines and method of making the same | Raghuveer S. Makala, Fumitaka Amano | 2024-05-21 |