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Peter Rabkin — 134 Patents

STSandisk Technologies: 117 patents #22 of 2,594Top 1%

SHSk Hynix: 10 patents #756 of 4,849Top 20%

HAHynix Semiconductor America: 4 patents #1 of 5Top 20%

HAHyundai Electronics America: 1 patents #75 of 148Top 55%

AMD: 1 patents #5,812 of 9,280Top 65%

Cupertino, CA: #53 of 6,989 inventorsTop 1%

California: #1,268 of 386,348 inventorsTop 1%

Overall (All Time): #7,896 of 4,157,543Top 1%

134 Patents All Time

Peter Rabkin has been granted 134 US patents while listed as an inventor at Sandisk Technologies. The first was granted in 2003 and the most recent in October 2025. Peter Rabkin ranks #7,896 of 4,157,543 US inventors in our database (top 0.19%). Patent records list Peter Rabkin in Cupertino, CA, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 134 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12457741	Memory device including composite metal oxide semiconductor channels and methods for forming the same	Masaaki Higashitani	2025-10-28
12349353	Three-dimensional nor array and method of making the same	Masaaki Higashitani, Hiroyuki Kinoshita, Satoshi Shimizu, Yanli Zhang, Johann Alsmeier	2025-07-01
12347804	Bonded assembly including interconnect-level bonding pads and methods of forming the same	Lin Hou, Yangyin Chen, Masaaki Higashitani, Rahul Sharangpani	2025-07-01
12342543	Three-dimensional nor array and method of making the same	Masaaki Higashitani, Hiroyuki Kinoshita	2025-06-24
12289887	Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making the same	Masaaki Higashitani	2025-04-29
12245425	Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof	Masaaki Higashitani	2025-03-04
12219756	Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof	Masaaki Higashitani	2025-02-04
12125814	Bonded assembly containing different size opposing bonding pads and methods of forming the same	Lin Hou, Masaaki Higashitani	2024-10-22
12127410	Memory device including a ferroelectric semiconductor channel and methods of forming the same	Masaaki Higashitani	2024-10-22
12016179	Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof	Masaaki Higashitani	2024-06-18
11963352	Three-dimensional memory device with vertical field effect transistors and method of making thereof	Masaaki Higashitani	2024-04-16
11948902	Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same	Lin Hou, Adarsh Rajashekhar, Raghuveer S. Makala, Masaaki Higashitani	2024-04-02
11869877	Bonded assembly including inter-die via structures and methods for making the same	Lin Hou, Yangyin Chen, Masaaki Higashitani	2024-01-09
11778817	Three-dimensional memory device including III-V compound semiconductor channel layer and method of making the same	Ashish Baraskar, Raghuveer S. Makala	2023-10-03
11728305	Capacitor structure including bonding pads as electrodes and methods of forming the same	Shiqian Shao, Fumiaki Toyama	2023-08-15
11721727	Three-dimensional memory device including a silicon-germanium source contact layer and method of making the same	Ashish Baraskar, Raghuveer S. Makala	2023-08-08
11676954	Bonded three-dimensional memory devices with backside source power supply mesh and methods of making the same	Masaaki Higashitani, Kwang Ho Kim	2023-06-13
11646081	Reliability compensation for uneven NAND block degradation	Xiang Yang, Henry Chin, Ken Oowada, Dengtao Zhao, Gerrit Jan Hemink	2023-05-09
11646282	Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same	Lin Hou, Masaaki Higashitani	2023-05-09
11646283	Bonded assembly containing low dielectric constant bonding dielectric material	Lin Hou, Masaaki Higashitani, Ramy Nashed Bassely Said	2023-05-09
11569215	Three-dimensional memory device with vertical field effect transistors and method of making thereof	Kwang Ho Kim	2023-01-31
11562975	Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the same	Lin Hou, Masaaki Higashitani	2023-01-24
11538828	Three-dimensional memory device with high mobility channels and nickel aluminum silicide or germanide drain contacts and method of making the same	Ashish Baraskar, Raghuveer S. Makala	2022-12-27
11508654	Non-volatile memory with capacitors using metal under signal line or above a device capacitor	Luisa Lin, Mohan Dunga, Venkatesh Ramachandra, Masaaki Higashitani	2022-11-22
11508748	Three-dimensional memory device containing III-V compound semiconductor channel and contacts and method of making the same	Ashish Baraskar, Raghuveer S. Makala	2022-11-22