JA

Johann Alsmeier

ST Sandisk Technologies: 206 patents #2 of 2,224Top 1%
SA Siemens Aktiengesellschaft: 21 patents #286 of 22,248Top 2%
IBM: 11 patents #9,995 of 70,183Top 15%
Infineon Technologies Ag: 7 patents #1,452 of 7,486Top 20%
S3 Sandisk 3D: 5 patents #86 of 180Top 50%
SC Siemens Components: 1 patents #6 of 30Top 20%
Overall (All Time): #2,091 of 4,157,543Top 1%
245
Patents All Time

Issued Patents All Time

Showing 25 most recent of 245 patents

Patent #TitleCo-InventorsDate
12349353 Three-dimensional nor array and method of making the same Masaaki Higashitani, Peter Rabkin, Hiroyuki Kinoshita, Satoshi Shimizu, Yanli Zhang 2025-07-01
12322710 Three-dimensional memory device with finned support pillar structures and method of forming the same Jixin Yu, Koichi Matsuno 2025-06-03
12279445 Field effect transistors with gate fins and method of making the same Srinivas Pulugurtha, Yanli Zhang, Mitsuhiro Togo 2025-04-15
12243865 Bonded semiconductor die assembly containing through-stack via structures and methods for making the same James Kai, Koichi Matsuno 2025-03-04
12148710 Three-dimensional memory device containing bridges for enhanced structural support and methods of forming the same Koichi Matsuno 2024-11-19
12096632 Three-dimensional memory device with multiple types of support pillar structures and method of forming the same Koichi Matsuno 2024-09-17
12087371 Preventing erase disturb in NAND Yanli Zhang, James Kai 2024-09-10
12029036 Three-dimensional memory device with multiple types of support pillar structures and method of forming the same Kenichi Shimomura, Koichi Matsuno 2024-07-02
11968839 Memory device using a multilayer ferroelectric stack and method of forming the same Yanli Zhang 2024-04-23
11903218 Bonded memory devices and methods of making the same Raghuveer S. Makala 2024-02-13
11871580 Three-dimensional memory device including low-k drain-select-level isolation structures and methods of forming the same Peng Zhang, Yanli Zhang, Xiang Yang, Koichi Matsuno, Masaaki Higashitani 2024-01-09
11856765 Three-dimensional memory device including low-k drain-select-level isolation structures and methods of forming the same Koichi Matsuno, Masaaki Higashitani 2023-12-26
11805649 Three-dimensional memory device with wiggled drain-select-level isolation structure and methods of manufacturing the same Srinivas Pulugurtha, Yanli Zhang, James Kai 2023-10-31
11587920 Bonded semiconductor die assembly containing through-stack via structures and methods for making the same James Kai, Koichi Matsuno 2023-02-21
11552094 Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same James Kai, Murshed Chowdhury, Masaaki Higashitani 2023-01-10
11538817 Bonded memory devices and methods of making the same Raghuveer S. Makala 2022-12-27
11532570 Three-dimensional memory device containing bridges for enhanced structural support and methods of forming the same Genta Mizuno, Kenzo IIZUKA, Satoshi Shimizu, Keisuke Izumi, Tatsuya Hinoue +5 more 2022-12-20
11489043 Three-dimensional memory device employing thinned insulating layers and methods for forming the same James Kai, Senaka Kanakamedala 2022-11-01
11481154 Non-volatile memory with memory array between circuits Deepanshu Dutta, James Kai, Jian Chen 2022-10-25
11469251 Memory device using a multilayer ferroelectric stack and method of forming the same Yanli Zhang 2022-10-11
RE49165 On-pitch drain select level isolation structure for three-dimensional memory device and method of making the same Yanli Zhang, Masanori Tsutsumi, Shinsuke Yada, Sayako Nagamine 2022-08-09
11398496 Three-dimensional memory device employing thinned insulating layers and methods for forming the same James Kai, Senaka Kanakamedala 2022-07-26
11387142 Semiconductor device containing bit lines separated by air gaps and methods for forming the same Koichi Matsuno, Masaaki Higashitani 2022-07-12
11380707 Three-dimensional memory device including backside trench support structures and methods of forming the same Koichi Matsuno, Jixin Yu 2022-07-05
11296101 Three-dimensional memory device including an inter-tier etch stop layer and method of making the same Yao-Sheng Lee, Senaka Kanakamedala, Raghuveer S. Makala 2022-04-05