Issued Patents All Time
Showing 1–25 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12010841 | Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings | Monica Titus, Senaka Kanakamedala, Rahul Sharangpani, Raghuveer S. Makala | 2024-06-11 |
| 11621277 | Multilevel memory stack structure with tapered inter-tier joint region and methods of making thereof | Monica Titus, Zhixin Cui, Senaka Kanakamedala, Chih-Yu Lee | 2023-04-04 |
| 11469241 | Three-dimensional memory device including discrete charge storage elements and methods of forming the same | Raghuveer S. Makala, Senaka Kanakamedala, Fei Zhou | 2022-10-11 |
| 11430736 | Semiconductor device including having metal organic framework interlayer dielectric layer between metal lines and methods of forming the same | Ramy Nashed Bassely Said, Raghuveer S. Makala, Senaka Kanakamedala | 2022-08-30 |
| 11387244 | Three-dimensional memory device including discrete charge storage elements and methods of forming the same | Raghuveer S. Makala, Senaka Kanakamedala, Fei Zhou | 2022-07-12 |
| 11387250 | Three-dimensional memory device containing metal-organic framework inter-word line insulating layers | Ramy Nashed Bassely Said, Senaka Kanakamedala, Fei Zhou, Raghuveer S. Makala | 2022-07-12 |
| 11296028 | Semiconductor device containing metal-organic framework inter-line insulator structures and methods of manufacturing the same | Ramy Nashed Bassely Said, Senaka Kanakamedala, Fei Zhou, Raghuveer S. Makala | 2022-04-05 |
| 11296101 | Three-dimensional memory device including an inter-tier etch stop layer and method of making the same | Senaka Kanakamedala, Raghuveer S. Makala, Johann Alsmeier | 2022-04-05 |
| 11244953 | Three-dimensional memory device including molybdenum word lines and metal oxide spacers and method of making the same | Senaka Kanakamedala, Raghuveer S. Makala | 2022-02-08 |
| 11171097 | Bonded assembly containing metal-organic framework bonding dielectric and methods of forming the same | Ramy Nashed Bassely Said, Raghuveer S. Makala, Senaka Kanakamedala, Fei Zhou | 2021-11-09 |
| 11114406 | Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip | Senaka Kanakamedala, Raghuveer S. Makala, Jian Chen | 2021-09-07 |
| 10950629 | Three-dimensional flat NAND memory device having high mobility channels and methods of making the same | Raghuveer S. Makala, Fei Zhou, Senaka Kanakamedala | 2021-03-16 |
| 10847408 | Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip | Raghuveer S. Makala, Senaka Kanakamedala, Jian Chen | 2020-11-24 |
| 10741572 | Three-dimensional memory device having multilayer word lines containing selectively grown cobalt or ruthenium and method of making the same | Rahul Sharangpani, Raghuveer S. Makala, Yanli Zhang | 2020-08-11 |
| 10700086 | Three-dimensional flat NAND memory device having high mobility channels and methods of making the same | Raghuveer S. Makala, Fei Zhou, Senaka Kanakamedala | 2020-06-30 |
| 10622368 | Three-dimensional memory device with semicircular metal-semiconductor alloy floating gate electrodes and methods of making thereof | Senaka Kanakamedala, Raghuveer S. Makala, Rahul Sharangpani, Somesh Peri, James Kai | 2020-04-14 |
| 10475879 | Support pillar structures for leakage reduction in a three-dimensional memory device and methods of making the same | Jayavel Pachamuthu, Hiroyuki Kinoshita | 2019-11-12 |
| 10468596 | Damascene process for forming three-dimensional cross rail phase change memory devices | Raghuveer S. Makala, Senaka Kanakamedala | 2019-11-05 |
| 10461163 | Three-dimensional memory device with thickened word lines in terrace region and method of making thereof | Senaka Kanakamedala, Yoshihiro Kanno, Raghuveer S. Makala, Yanli Zhang, Jin Liu +1 more | 2019-10-29 |
| 10438964 | Three-dimensional memory device having direct source contact and metal oxide blocking dielectric and method of making thereof | Raghuveer S. Makala, Senaka Kanakamedala, Yanli Zhang | 2019-10-08 |
| 10381434 | Support pillar structures for leakage reduction in a three-dimensional memory device | Jayavel Pachamuthu, Hiroyuki Kinoshita | 2019-08-13 |
| 10269620 | Multi-tier memory device with through-stack peripheral contact via structures and method of making thereof | Jixin Yu, Zhenyu Lu, Hiroyuki Ogawa, Daxin Mao, Kensuke Yamaguchi +2 more | 2019-04-23 |
| 10262945 | Three-dimensional array device having a metal containing barrier and method of making thereof | Raghuveer S. Makala, Murshed Chowdhury, Keerti Shukla, Tomohisa Abe, James Kai | 2019-04-16 |
| 10256247 | Three-dimensional memory device with silicided word lines, air gap layers and discrete charge storage elements, and method of making thereof | Senaka Kanakamedala, Raghuveer S. Makala | 2019-04-09 |
| 10199434 | Three-dimensional cross rail phase change memory device and method of manufacturing the same | Senaka Kanakamedala, Raghuveer S. Makala | 2019-02-05 |