James Kai — 153 Patents at Sandisk Technologies

James Kai has been granted 153 US patents while listed as an inventor at Sandisk Technologies. The first was granted in 1998 and the most recent in October 2025. James Kai ranks #5,988 of 4,157,543 US inventors in our database (top 0.14%). Patent records list James Kai in Santa Clara, CA, US.

Issued Patents All Time

Showing 1–25 of 153 patents

Patent #	Title	Co-Inventors	Date
12456499	Three-dimensional memory device including laterally separated source lines and method of making the same	Masaaki Higashitani, Johann Alsmeier	2025-10-28
12243593	Low power read method and a memory device capable thereof	Xiang Yang, Deepanshu Dutta, Ohwon Kwon, Yuki Mizutani	2025-03-04
12243865	Bonded semiconductor die assembly containing through-stack via structures and methods for making the same	Johann Alsmeier, Koichi Matsuno	2025-03-04
12087371	Preventing erase disturb in NAND	Yanli Zhang, Johann Alsmeier	2024-09-10
11996153	Three-dimensional memory device with separated contact regions and methods for forming the same	Yuki Mizutani, Hisakazu Otoi, Masaaki Higashitani, Hiroyuki Ogawa	2024-05-28
11990185	Dynamic word line reconfiguration for NAND structure	Xiang Yang, YenLung Li	2024-05-21
11805649	Three-dimensional memory device with wiggled drain-select-level isolation structure and methods of manufacturing the same	Srinivas Pulugurtha, Johann Alsmeier, Yanli Zhang	2023-10-31
11587920	Bonded semiconductor die assembly containing through-stack via structures and methods for making the same	Johann Alsmeier, Koichi Matsuno	2023-02-21
11552094	Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same	Murshed Chowdhury, Masaaki Higashitani, Johann Alsmeier	2023-01-10
11489043	Three-dimensional memory device employing thinned insulating layers and methods for forming the same	Senaka Kanakamedala, Johann Alsmeier	2022-11-01
11481154	Non-volatile memory with memory array between circuits	Deepanshu Dutta, Johann Alsmeier, Jian Chen	2022-10-25
11398496	Three-dimensional memory device employing thinned insulating layers and methods for forming the same	Senaka Kanakamedala, Johann Alsmeier	2022-07-26
11380709	Three dimensional ferroelectric memory	Yingda Dong, Christopher J. Petti	2022-07-05
11355486	Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer	Yuki Mizutani, Masaaki Higashitani	2022-06-07
11201107	Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer	Teruo Okina, Akio Nishida	2021-12-14
11195857	Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer	Ching-Huang Lu, Murshed Chowdhury, Johann Alsmeier	2021-12-07
11195781	Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer	Teruo Okina, Akio Nishida	2021-12-07
11127729	Method for removing a bulk substrate from a bonded assembly of wafers	Murshed Chowdhury, Koichi Matsuno, Johann Alsmeier	2021-09-21
11043455	Three-dimensional memory device including self-aligned dielectric isolation regions for connection via structures and method of making the same	Johann Alsmeier, Jixin Yu	2021-06-22
11037943	Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same	Muneyuki Imai	2021-06-15
11018153	Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes	Johann Alsmeier, Murshed Chowdhury	2021-05-25
10985169	Three-dimensional device with bonded structures including a support die and methods of making the same	Murshed Chowdhury, Koichi Matsuno, Johann Alsmeier	2021-04-20
10950626	Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes	Johann Alsmeier, Murshed Chowdhury, Raiden Matsuno	2021-03-16
10943917	Three-dimensional memory device with drain-select-level isolation structures and method of making the same	Takaaki Iwai, Makoto Koto, Sayako Nagamine, Ching-Huang Lu, Wei Zhao +1 more	2021-03-09
10840260	Through-array conductive via structures for a three-dimensional memory device and methods of making the same	Murshed Chowdhury, Fumiaki Toyama, Johann Alsmeier, Masaaki Higashitani	2020-11-17

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James Kai — 153 Patents

Issued Patents All Time

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