Issued Patents All Time
Showing 25 most recent of 152 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243593 | Low power read method and a memory device capable thereof | Xiang Yang, Deepanshu Dutta, Ohwon Kwon, Yuki Mizutani | 2025-03-04 |
| 12243865 | Bonded semiconductor die assembly containing through-stack via structures and methods for making the same | Johann Alsmeier, Koichi Matsuno | 2025-03-04 |
| 12087371 | Preventing erase disturb in NAND | Yanli Zhang, Johann Alsmeier | 2024-09-10 |
| 11996153 | Three-dimensional memory device with separated contact regions and methods for forming the same | Yuki Mizutani, Hisakazu Otoi, Masaaki Higashitani, Hiroyuki Ogawa | 2024-05-28 |
| 11990185 | Dynamic word line reconfiguration for NAND structure | Xiang Yang, YenLung Li | 2024-05-21 |
| 11805649 | Three-dimensional memory device with wiggled drain-select-level isolation structure and methods of manufacturing the same | Srinivas Pulugurtha, Johann Alsmeier, Yanli Zhang | 2023-10-31 |
| 11587920 | Bonded semiconductor die assembly containing through-stack via structures and methods for making the same | Johann Alsmeier, Koichi Matsuno | 2023-02-21 |
| 11552094 | Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same | Murshed Chowdhury, Masaaki Higashitani, Johann Alsmeier | 2023-01-10 |
| 11489043 | Three-dimensional memory device employing thinned insulating layers and methods for forming the same | Senaka Kanakamedala, Johann Alsmeier | 2022-11-01 |
| 11481154 | Non-volatile memory with memory array between circuits | Deepanshu Dutta, Johann Alsmeier, Jian Chen | 2022-10-25 |
| 11398496 | Three-dimensional memory device employing thinned insulating layers and methods for forming the same | Senaka Kanakamedala, Johann Alsmeier | 2022-07-26 |
| 11380709 | Three dimensional ferroelectric memory | Yingda Dong, Christopher J. Petti | 2022-07-05 |
| 11355486 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Yuki Mizutani, Masaaki Higashitani | 2022-06-07 |
| 11201107 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, Akio Nishida | 2021-12-14 |
| 11195857 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Ching-Huang Lu, Murshed Chowdhury, Johann Alsmeier | 2021-12-07 |
| 11195781 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, Akio Nishida | 2021-12-07 |
| 11127729 | Method for removing a bulk substrate from a bonded assembly of wafers | Murshed Chowdhury, Koichi Matsuno, Johann Alsmeier | 2021-09-21 |
| 11043455 | Three-dimensional memory device including self-aligned dielectric isolation regions for connection via structures and method of making the same | Johann Alsmeier, Jixin Yu | 2021-06-22 |
| 11037943 | Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same | Muneyuki Imai | 2021-06-15 |
| 11018153 | Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes | Johann Alsmeier, Murshed Chowdhury | 2021-05-25 |
| 10985169 | Three-dimensional device with bonded structures including a support die and methods of making the same | Murshed Chowdhury, Koichi Matsuno, Johann Alsmeier | 2021-04-20 |
| 10950626 | Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes | Johann Alsmeier, Murshed Chowdhury, Raiden Matsuno | 2021-03-16 |
| 10943917 | Three-dimensional memory device with drain-select-level isolation structures and method of making the same | Takaaki Iwai, Makoto Koto, Sayako Nagamine, Ching-Huang Lu, Wei Zhao +1 more | 2021-03-09 |
| 10840260 | Through-array conductive via structures for a three-dimensional memory device and methods of making the same | Murshed Chowdhury, Fumiaki Toyama, Johann Alsmeier, Masaaki Higashitani | 2020-11-17 |
| 10825827 | Non-volatile memory with pool capacitor | Mohan Dunga, Venkatesh Ramachandra, Piyush Dak, Luisa Lin, Masaaki Higashitani | 2020-11-03 |