Issued Patents All Time
Showing 25 most recent of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101936 | Three dimensional memory device and method of making thereof by forming channel and memory film after word line replacement | Tatsuya Hinoue, Yusuke Mukae, Ryousuke Itou, Masanori Tsutsumi, Ramy Nashed Bassely Said | 2024-09-24 |
| 12058854 | Three-dimensional memory device with isolated source strips and method of making the same | Takaaki Iwai, Masanori Tsutsumi | 2024-08-06 |
| 11889684 | Three-dimensional memory device with separated source-side lines and method of making the same | Masanori Tsutsumi, Shinsuke Yada, Mitsuteru Mushiga, Hiroyuki Ogawa, Teruo Okina | 2024-01-30 |
| 11791327 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Fumiaki Toyama | 2023-10-17 |
| 11587943 | Bonded die assembly using a face-to-back oxide bonding and methods for making the same | Masatoshi Nishikawa | 2023-02-21 |
| 11393836 | Three-dimensional memory device with separated source-side lines and method of making the same | Masanori Tsutsumi, Shinsuke Yada, Mitsuteru Mushiga, Hiroyuki Ogawa, Teruo Okina | 2022-07-19 |
| 11276708 | Three-dimensional device with bonded structures including a support die and methods of making the same | Mitsuteru Mushiga | 2022-03-15 |
| 11201107 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, James Kai | 2021-12-14 |
| 11195781 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, James Kai | 2021-12-07 |
| 11133297 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Fumiaki Toyama | 2021-09-28 |
| 11069703 | Three-dimensional device with bonded structures including a support die and methods of making the same | Mitsuteru Mushiga, Zhixin Cui | 2021-07-20 |
| 11011506 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Kazuma Shimamoto, Tetsuya Shirasu, Yuji Fukano | 2021-05-18 |
| 10957680 | Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same | Shinsuke Yada, Masanori Tsutsumi, Sayako Nagamine, Yuji Fukano, Christopher J. Petti | 2021-03-23 |
| 10923496 | Three-dimensional memory device containing a replacement buried source line and methods of making the same | Mitsuteru Mushiga, Kenji Sugiura, Ryosuke Kaneko, Michiaki Sano | 2021-02-16 |
| 10923462 | Bifurcated memory die module semiconductor device | Toshiki Hirano, Gokul Kumar, Yan Li, Michael Mostovoy | 2021-02-16 |
| 10903164 | Bonded assembly including a semiconductor-on-insulator die and methods for making the same | — | 2021-01-26 |
| 10833100 | Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same | Kenji Sugiura, Mitsuteru Mushiga, Yuji Fukano | 2020-11-10 |
| 10811058 | Bonded assembly containing memory die bonded to integrated peripheral and system die and methods for making the same | Yanli Zhang, Zhixin Cui, Johann Alsmeier, Yan Li, Steven T. Sprouse | 2020-10-20 |
| 10804202 | Bonded assembly including a semiconductor-on-insulator die and methods for making the same | — | 2020-10-13 |
| 10797070 | Three-dimensional memory device containing a replacement buried source line and methods of making the same | Mitsuteru Mushiga, Kenji Sugiura | 2020-10-06 |
| 10797062 | Bonded die assembly using a face-to-back oxide bonding and methods for making the same | Masatoshi Nishikawa | 2020-10-06 |
| 10797061 | Three-dimensional memory device having stressed vertical semiconductor channels and method of making the same | Toshihiro Iizuka, Rahul Sharangpani, Raghuveer S. Makala, Adarsh Rajashekhar, Fei Zhou +1 more | 2020-10-06 |
| 10797060 | Three-dimensional memory device having stressed vertical semiconductor channels and method of making the same | Rahul Sharangpani, Raghuveer S. Makala, Adarsh Rajashekhar, Fei Zhou, Srikanth Ranganathan +1 more | 2020-10-06 |
| 10741576 | Three-dimensional memory device containing drain-select-level air gap and methods of making the same | Masatoshi Nishikawa | 2020-08-11 |
| 10714497 | Three-dimensional device with bonded structures including a support die and methods of making the same | Mitsuteru Mushiga | 2020-07-14 |