Issued Patents All Time
Showing 26–50 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10700028 | Vertical chip interposer and method of making a chip assembly containing the vertical chip interposer | — | 2020-06-30 |
| 10665580 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Kazuma Shimamoto, Tetsuya Shirasu, Yuji Fukano | 2020-05-26 |
| 10665607 | Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same | Kenji Sugiura, Mitsuteru Mushiga, Yuji Fukano | 2020-05-26 |
| 10515897 | Three-dimensional memory device containing hydrogen diffusion blocking structures and method of making the same | Masatoshi Nishikawa, Murshed Chowdhury, Takahito Fujita, Kiyokazu Shishido, Hiroyuki Ogawa | 2019-12-24 |
| 10516025 | Three-dimensional NAND memory containing dual protrusion charge trapping regions and methods of manufacturing the same | Masatoshi Nishikawa, Hisakazu Otoi | 2019-12-24 |
| 10510738 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Fumiaki Toyama | 2019-12-17 |
| 10354980 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Mitsuteru Mushiga, Kenji Sugiura, Hisakazu Otoi, Masatoshi Nishikawa | 2019-07-16 |
| 10355100 | Field effect transistors having different stress control liners and method of making the same | Yu Ueda, Tomoyuki Obu, Kazutaka Yoshizawa, Yasuyuki Aoki, Eisuke Takii | 2019-07-16 |
| 10354987 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Mitsuteru Mushiga, Kenji Sugiura, Hisakazu Otoi, Masatoshi Nishikawa | 2019-07-16 |
| 10283566 | Three-dimensional memory device with through-stack contact via structures and method of making thereof | Jongsun Sel, Tuan Pham, Mitsuteru Mushiga, Yoshihiro Ikeda, Daewung Kang | 2019-05-07 |
| 10283493 | Three-dimensional memory device containing bonded memory die and peripheral logic die and method of making thereof | — | 2019-05-07 |
| 10224373 | Three-dimensional ReRAM memory device employing replacement word lines and methods of making the same | Jongsun Sel, Mitsuteru Mushiga, Vincent Shih, Tuan Pham | 2019-03-05 |
| 9673304 | Methods and apparatus for vertical bit line structures in three-dimensional nonvolatile memory | Michiaki Sano, Akira Nakada, Tetsuya Yamada, Manabu Hayashi, Takashi Matsubara +1 more | 2017-06-06 |
| 9530485 | Semiconductor integrated circuit device with reduced leakage current | Kenichi Osada, Koichiro Ishibashi, Yoshikazu Saitoh, Masaru Nakamichi, Naoki Kitai | 2016-12-27 |
| 9443910 | Silicided bit line for reversible-resistivity memory | Kan Fujiwara, Takuya Futase, Toshihiro Iizuka, Shin Kikuchi, Yoichiro Tanaka +1 more | 2016-09-13 |
| 9356110 | Semiconductor device and manufacturing method thereof | Masao Inoue, Yoshiki Maruyama, Yorinobu Kunimune, Kota Funayama | 2016-05-31 |
| 9349743 | Method of manufacturing semiconductor device | Nobuto Nakanishi, Yoshiyuki Kawashima | 2016-05-24 |
| 9324726 | Method for manufacturing a semiconductor device | Yoshiyuki Kawashima, Hiraku Chakihara, Kyoko Umeda | 2016-04-26 |
| 9111636 | Semiconductor integrated circuit device with reduced leakage current | Kenichi Osada, Koichiro Ishibashi, Yoshikazu Saitoh, Masaru Nakamichi, Naoki Kitai | 2015-08-18 |
| 8797791 | Semiconductor integrated circuit device with reduced leakage current | Kenichi Osada, Koichiro Ishibashi, Yoshikazu Saitoh, Masaru Nakamichi, Naoki Kitai | 2014-08-05 |
| 8669172 | Method of manufacturing nonvolatile semiconductor device | Yasuaki Yonemochi, Hisakazu Otoi, Shigeru Shiratake | 2014-03-11 |
| 8587970 | Isolated switching power supply apparatus including primary-side and secondary-side digital control circuits | Yoshiyuki Uno | 2013-11-19 |
| 8476138 | Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device | Hiraku Chakihara, Kousuke Okuyama, Masahiro Moniwa, Makoto Mizuno, Keiji Okamoto +3 more | 2013-07-02 |
| 8437179 | Semiconductor integrated circuit device with reduced leakage current | Kenichi Osada, Koichiro Ishibashi, Yoshikazu Saitoh, Masaru Nakamichi, Naoki Kitai | 2013-05-07 |
| 8232589 | Semiconductor integrated circuit device with reduced leakage current | Kenichi Osada, Koichiro Ishibashi, Yoshikazu Saitoh, Masaru Nakamichi, Naoki Kitai | 2012-07-31 |