Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424602 | Bonded assembly containing conductive via structures extending through word lines in a staircase region and methods for making the same | Masanori Tsutsumi, Hiroyuki Ogawa | 2025-09-23 |
| 11935784 | Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the same | Fumitaka Amano, Yusuke OSAWA, Kensuke Ishikawa, Motoki KAWASAKI, Shinsuke Yada +4 more | 2024-03-19 |
| 11889684 | Three-dimensional memory device with separated source-side lines and method of making the same | Masanori Tsutsumi, Shinsuke Yada, Akio Nishida, Hiroyuki Ogawa, Teruo Okina | 2024-01-30 |
| 11501821 | Three-dimensional memory device containing a shared word line driver across different tiers and methods for making the same | Hiroyuki Ogawa, Ken Oowada | 2022-11-15 |
| 11393836 | Three-dimensional memory device with separated source-side lines and method of making the same | Masanori Tsutsumi, Shinsuke Yada, Akio Nishida, Hiroyuki Ogawa, Teruo Okina | 2022-07-19 |
| 11322483 | Three-dimensional memory device containing a shared word line driver across different tiers and methods for making the same | Hiroyuki Ogawa, Ken Oowada | 2022-05-03 |
| 11276708 | Three-dimensional device with bonded structures including a support die and methods of making the same | Akio Nishida | 2022-03-15 |
| 11069703 | Three-dimensional device with bonded structures including a support die and methods of making the same | Akio Nishida, Zhixin Cui | 2021-07-20 |
| 10923496 | Three-dimensional memory device containing a replacement buried source line and methods of making the same | Kenji Sugiura, Akio Nishida, Ryosuke Kaneko, Michiaki Sano | 2021-02-16 |
| 10892267 | Three-dimensional memory device containing through-memory-level contact via structures and method of making the same | Kenji Sugiura, Hisakazu Otoi, Shigehisa Inoue, Yuki Fukuda | 2021-01-12 |
| 10847524 | Three-dimensional memory device having double-width staircase regions and methods of manufacturing the same | Yoshitaka Otsu, Yasushi Doda | 2020-11-24 |
| 10833100 | Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same | Kenji Sugiura, Yuji Fukano, Akio Nishida | 2020-11-10 |
| 10797070 | Three-dimensional memory device containing a replacement buried source line and methods of making the same | Kenji Sugiura, Akio Nishida | 2020-10-06 |
| 10714497 | Three-dimensional device with bonded structures including a support die and methods of making the same | Akio Nishida | 2020-07-14 |
| 10665607 | Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same | Kenji Sugiura, Yuji Fukano, Akio Nishida | 2020-05-26 |
| 10629611 | Three-dimensional memory device and methods of making the same using replacement drain select gate electrodes | Zhixin Cui, Kiyohiko Sakakibara, Hisakazu Otoi, Kenji Sugiura | 2020-04-21 |
| 10586803 | Three-dimensional memory device and methods of making the same using replacement drain select gate electrodes | Hisakazu Otoi, Kenji Sugiura, Zhixin Cui, Kiyohiko Sakakibara | 2020-03-10 |
| 10553599 | Three-dimensional memory device containing drain select isolation structures and on-pitch channels and methods of making the same without an etch stop layer | Zhen Chen, Michiaki Sano | 2020-02-04 |
| 10490569 | Three-dimensional memory device and method of making the same using concurrent formation of memory openings and contact openings | Hisakazu Otoi, Kensuke Yamaguchi, James Kai, Zhixin Cui, Murshed Chowdhury +2 more | 2019-11-26 |
| 10490564 | Three-dimensional memory device and methods of making the same using replacement drain select gate electrodes | Hisakazu Otoi, Kenji Sugiura | 2019-11-26 |
| 10354980 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Akio Nishida, Kenji Sugiura, Hisakazu Otoi, Masatoshi Nishikawa | 2019-07-16 |
| 10354987 | Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same | Akio Nishida, Kenji Sugiura, Hisakazu Otoi, Masatoshi Nishikawa | 2019-07-16 |
| 10283566 | Three-dimensional memory device with through-stack contact via structures and method of making thereof | Jongsun Sel, Tuan Pham, Yoshihiro Ikeda, Daewung Kang, Akio Nishida | 2019-05-07 |
| 10224373 | Three-dimensional ReRAM memory device employing replacement word lines and methods of making the same | Jongsun Sel, Vincent Shih, Akio Nishida, Tuan Pham | 2019-03-05 |
| 10115770 | Methods and apparatus for three-dimensional nonvolatile memory | Jongsun Sel, Daewung Kang, Michiaki Sano, Yohei Yamada, Tuan Pham | 2018-10-30 |