Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289429 | Three-dimensional memory die containing stress-compensating slit trench structures and methods for making the same | — | 2022-03-29 |
| 11011506 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Tetsuya Shirasu, Yuji Fukano, Akio Nishida | 2021-05-18 |
| 10665580 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Tetsuya Shirasu, Yuji Fukano, Akio Nishida | 2020-05-26 |
| 9461049 | Semiconductor device | — | 2016-10-04 |
| 9035368 | Semiconductor device | — | 2015-05-19 |