Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406729 | Non-volatile memory with inter-die connection | Shiqian Shao, Tuan Pham | 2025-09-02 |
| 12354955 | Three-dimensional memory device with high contact via density and methods of forming the same | Tomohiro Kubo, Hirofumi TOKITA, Shiqian Shao | 2025-07-08 |
| 12347492 | Three-dimensional memory device with high contact via density and methods of forming the same | Hirofumi TOKITA, Tomohiro Kubo, Shiqian Shao | 2025-07-01 |
| 12230335 | Data latch programming algorithm for multi-bit-per-cell memory devices | Toru Miwa | 2025-02-18 |
| 12207459 | Three-dimensional memory array with dual-level peripheral circuits and methods for forming the same | Yuki Mizutani, Masaaki Higashitani | 2025-01-21 |
| 12004348 | Three-dimensional memory array with dual-level peripheral circuits and methods for forming the same | Yuki Mizutani, Masaaki Higashitani | 2024-06-04 |
| 11973044 | Non-volatile memory with efficient signal routing | Shiqian Shao, Tuan Pham | 2024-04-30 |
| 11943922 | Non-volatile memory with three dimensional stacked word line switches | Guangyuan Li, Qinghua Zhao, Sudarshan Narayanan, Yuji Totoki | 2024-03-26 |
| 11894056 | Non-volatile memory with efficient word line hook-up | Shiqian Shao | 2024-02-06 |
| 11817150 | Non-volatile memory with different word line hook up regions based on pass through signals | Shiqian Shao | 2023-11-14 |
| 11792988 | Three-dimensional memory device with separated contact regions and methods for forming the same | Hiroyuki Ogawa | 2023-10-17 |
| 11791327 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Akio Nishida | 2023-10-17 |
| 11758730 | Bonded assembly of a memory die and a logic die including laterally shifted bit-line bonding pads and methods of forming the same | Jee-Yeon Kim | 2023-09-12 |
| 11728305 | Capacitor structure including bonding pads as electrodes and methods of forming the same | Shiqian Shao, Peter Rabkin | 2023-08-15 |
| 11424207 | Non-volatile memory with different use of metal lines in word line hook up regions | Shiqian Shao | 2022-08-23 |
| 11404123 | Non-volatile memory with multiple wells for word line switch transistors | Shiqian Shao, Yuki Mizutani, Mohan Dunga, Peter Rabkin | 2022-08-02 |
| 11342244 | Bonded assembly of semiconductor dies containing pad level across-die metal wiring and method of forming the same | Jee-Yeon Kim, Kwang Ho Kim | 2022-05-24 |
| 11251191 | Three-dimensional memory device containing multiple size drain contact via structures and method of making same | Lishan Weng, Mohan Dunga | 2022-02-15 |
| 11211370 | Bonded assembly with vertical power and control signal connection adjacent to sense amplifier regions and methods of forming the same | Jee-Yeon Kim, Yuki Mizutani | 2021-12-28 |
| 11139237 | Three-dimensional memory device containing horizontal and vertical word line interconnections and methods of forming the same | Shiqian Shao, Jee-Yeon Kim, Hirofumi TOKITA | 2021-10-05 |
| 11133297 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Akio Nishida | 2021-09-28 |
| 11114459 | Three-dimensional memory device containing width-modulated connection strips and methods of forming the same | Takaaki Iwai, Hirofumi TOKITA, Yoshitaka Otsu, Yuki Mizutani | 2021-09-07 |
| 11081443 | Multi-tier three-dimensional memory device containing dielectric well structures for contact via structures and methods of forming the same | Yuki Mizutani, Masayuki Hiroi | 2021-08-03 |
| 11011209 | Three-dimensional memory device including contact-level bit-line-connection structures and methods of making the same | Jee-Yeon Kim, Kwang Ho Kim, Yuki Mizutani | 2021-05-18 |
| 10991429 | Word line decoder circuitry under a three-dimensional memory array | Hiroyuki Ogawa, Takuya Ariki | 2021-04-27 |