| 12476174 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-11-18 |
|
| 12476235 |
Multi-chip packaging |
Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yan Sun +1 more |
2025-11-18 |
|
| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-09-02 |
|
| 12387999 |
Planar integrated circuit package interconnects |
Sanka Ganesan |
2025-08-12 |
|
| 12341080 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon |
2025-06-24 |
|
| 12341129 |
Substrateless double-sided embedded multi-die interconnect bridge |
Biancun Xie, Jianyong Xie, Sujit Sharan, Debendra Mallik |
2025-06-24 |
|
| 12334242 |
Coreless electronic substrates having embedded inductors |
Sanka Ganesan, Sri Chaitra Jyotsna Chavali, Anne Augustine, Kaladhar Radhakrishnan |
2025-06-17 |
|
| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik |
2025-05-13 |
|
| 12272656 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2025-04-08 |
|
| 12261124 |
Embedded die architecture and method of making |
Sanka Ganesan, Sri Chaitra Jyotsna Chavali |
2025-03-25 |
|
| 12199085 |
Multi-chip packaging |
Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more |
2025-01-14 |
|
| 12199048 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2025-01-14 |
|
| 12148703 |
EMIB patch on glass laminate substrate |
Robert Alan May |
2024-11-19 |
$25,575,000 |
| 12142568 |
Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making |
Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan |
2024-11-12 |
$28,491,000 |
| 12046560 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more |
2024-07-23 |
$20,446,000 |
| 12003023 |
In-package 3D antenna |
Zhenguo Jiang, Omkar G. Karhade, Srichaitra Chavali, Zhichao Zhang, Jimin Yao +2 more |
2024-06-04 |
$24,500,000 |
| 12002745 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Aleksandar Aleksov +6 more |
2024-06-04 |
$24,500,000 |
| 11978727 |
Package on active silicon semiconductor packages |
Wilfred Gomes, Sanka Ganesan, Doug B. Ingerly, Mark Bohr, Debendra Mallik |
2024-05-07 |
$26,756,000 |
| 11978689 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon |
2024-05-07 |
$26,756,000 |
| 11978685 |
Glass core patch with in situ fabricated fan-out layer to enable die tiling applications |
Srinivas V. Pietambaram, Rahul N. Manepalli, Gang Duan, Debendra Mallik |
2024-05-07 |
$26,756,000 |
| 11923257 |
Hybrid microelectronic substrates |
Robert Starkston, Scott M. Mokler, Richard C. Stamey, Amruthavalli Pallavi Alur |
2024-03-05 |
$29,696,000 |
| 11901248 |
Embedded die architecture and method of making |
Rahul N. Manepalli, Robert Alan May, Srinivas V. Pietambaram, Bharat P. Penmecha |
2024-02-13 |
$18,546,000 |
| 11894359 |
Distributed semiconductor die and package architecture |
Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley McCullough |
2024-02-06 |
$35,892,000 |
| 11894311 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more |
2024-02-06 |
$35,892,000 |
| 11870163 |
Antenna package using ball attach array to connect antenna and base substrates |
Jimin Yao, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang |
2024-01-09 |
$30,329,000 |
