Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Inorganic-based embedded-die layers for modular semiconductive devices

Inorganic-based embedded-die layers for modular semiconductive devices

US Patent 12300620 · Granted May 13, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Photonic interconnect and components in glass2025
Photonic interconnect and components in glass2025
Photonic interconnect and components in glass2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Integrated optical coupler2025
Integrated optical coupler2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Ultra-thin, hyper-density semiconductor packages2025