| 12512396 |
Flexible die to floor planning with bump pitch scale through glass core via pitch |
Andrew Collins, Srinivas V. Pietambaram, Aleksandar Aleksov, Telesphor Kamgaing |
2025-12-30 |
|
| 12504581 |
Photonic interconnect and components in glass |
Kristof Darmawikarta, Benjamin Duong, Srinivas V. Pietambaram, Hari Mahalingam, Bai Nie |
2025-12-23 |
|
| 12439826 |
Integrated MEMS resonator and method |
Mohamed A. Abdelmoneum, Eduardo Alban, Whitney Bryks, Brent Carlton, Nasser A. Kurd +3 more |
2025-10-07 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Jeremy Ecton, Omkar G. Karhade +5 more |
2025-09-23 |
|
| 12381029 |
Stepped coax MIL PTHS for modulating inductance within a package |
Brandon C. Marin, Krishna Bharath, Haifa Hariri |
2025-08-05 |
|
| 12362250 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2025-07-15 |
|
| 12345931 |
Optical circuit with optical port in sidewall |
Eric J. M. Moret, Srinivas V. Pietambaram |
2025-07-01 |
|
| 12345932 |
Die last and waveguide last architecture for silicon photonic packaging |
Bai Nie, Pooya Tadayon, Leonel Arana, Yonggang Li, Changhua Liu +4 more |
2025-07-01 |
|
| 12334447 |
Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) |
Kristof Darmawikarta, Siddharth K. Alur, Rahul Jain, Haobo Chen |
2025-06-17 |
|
| 12334453 |
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance |
Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more |
2025-06-17 |
|
| 12336197 |
In-plane inductors in IC packages |
Brandon C. Marin, Prithwish Chatterjee, Haifa Hariri, Yikang Deng, Sheng Li +1 more |
2025-06-17 |
|
| 12327797 |
Microelectronic structures including glass cores |
Srinivas V. Pietambaram, Gang Duan, Sai Vadlamani, Bharat P. Penmecha |
2025-06-10 |
|
| 12313890 |
Through-substrate optical vias |
Pooya Tadayon, Zhichao Zhang, Brandon C. Marin, Kemal Aygun, Stephen Andrew Smith |
2025-05-27 |
|
| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman |
2025-05-13 |
|
| 12272484 |
Coreless electronic substrates having embedded inductors |
Srinivas V. Pietambaram, Pooya Tadayon, Kristof Darmawikarta, Prithwish Chatterjee |
2025-04-08 |
|
| 12249584 |
Microelectronic assemblies having integrated magnetic core inductors |
Kristof Darmawikarta, Benjamin Duong, Srinivas V. Pietambaram |
2025-03-11 |
|
| 12230564 |
Package substrate z-disaggregation with liquid metal interconnects |
Brandon C. Marin, Karumbu Meyyappan, Valery Ouvarov-Bancalero, Dingying Xu |
2025-02-18 |
|
| 12181710 |
Photonic integrated circuit packaging architecture |
Omkar G. Karhade, Xiaoqian Li, Ravindranath V. Mahajan, Nitin A. Deshpande |
2024-12-31 |
$16,542,000 |
| 12176292 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more |
2024-12-24 |
$17,261,000 |
| 12068172 |
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages |
Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez |
2024-08-20 |
$20,163,000 |
| 12057252 |
Electronic substrates having embedded inductors |
Benjamin Duong, Michael Garelick, Darko Grujicic, Brandon C. Marin, Sai Vadlamani +1 more |
2024-08-06 |
$17,070,000 |
| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
2024-07-09 |
$24,938,000 |
| 12027466 |
Conductive route patterning for electronic substrates |
Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana +2 more |
2024-07-02 |
$27,114,000 |
| 12009271 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2024-06-11 |
$21,221,000 |
| 11923307 |
Microelectronic structures including bridges |
Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more |
2024-03-05 |
$29,696,000 |
