Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Jeremy Ecton, Omkar G. Karhade +5 more | 2025-09-23 |
| 12381029 | Stepped coax MIL PTHS for modulating inductance within a package | Brandon C. Marin, Krishna Bharath, Haifa Hariri | 2025-08-05 |
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12345931 | Optical circuit with optical port in sidewall | Eric J. M. Moret, Srinivas V. Pietambaram | 2025-07-01 |
| 12345932 | Die last and waveguide last architecture for silicon photonic packaging | Bai Nie, Pooya Tadayon, Leonel Arana, Yonggang Li, Changhua Liu +4 more | 2025-07-01 |
| 12336197 | In-plane inductors in IC packages | Brandon C. Marin, Prithwish Chatterjee, Haifa Hariri, Yikang Deng, Sheng Li +1 more | 2025-06-17 |
| 12334447 | Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) | Kristof Darmawikarta, Siddharth K. Alur, Rahul Jain, Haobo Chen | 2025-06-17 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more | 2025-06-17 |
| 12327797 | Microelectronic structures including glass cores | Srinivas V. Pietambaram, Gang Duan, Sai Vadlamani, Bharat P. Penmecha | 2025-06-10 |
| 12313890 | Through-substrate optical vias | Pooya Tadayon, Zhichao Zhang, Brandon C. Marin, Kemal Aygun, Stephen Andrew Smith | 2025-05-27 |
| 12300620 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2025-05-13 |
| 12272484 | Coreless electronic substrates having embedded inductors | Srinivas V. Pietambaram, Pooya Tadayon, Kristof Darmawikarta, Prithwish Chatterjee | 2025-04-08 |
| 12249584 | Microelectronic assemblies having integrated magnetic core inductors | Kristof Darmawikarta, Benjamin Duong, Srinivas V. Pietambaram | 2025-03-11 |
| 12230564 | Package substrate z-disaggregation with liquid metal interconnects | Brandon C. Marin, Karumbu Meyyappan, Valery Ouvarov-Bancalero, Dingying Xu | 2025-02-18 |
| 12181710 | Photonic integrated circuit packaging architecture | Omkar G. Karhade, Xiaoqian Li, Ravindranath V. Mahajan, Nitin A. Deshpande | 2024-12-31 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 |
| 12057252 | Electronic substrates having embedded inductors | Benjamin Duong, Michael Garelick, Darko Grujicic, Brandon C. Marin, Sai Vadlamani +1 more | 2024-08-06 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 12027466 | Conductive route patterning for electronic substrates | Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana +2 more | 2024-07-02 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2023-11-14 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2023-10-24 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |