Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Robert Alan May +1 more | 2025-07-08 |
| 12345932 | Die last and waveguide last architecture for silicon photonic packaging | Bai Nie, Pooya Tadayon, Yonggang Li, Changhua Liu, Kristof Darmawikarta +4 more | 2025-07-01 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more | 2025-06-24 |
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Kyle McElhinny, Onur Ozkan, Ali Lehaf, Xiaoying Guo, Steve Cho +4 more | 2025-06-17 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo +4 more | 2025-03-18 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 12027466 | Conductive route patterning for electronic substrates | Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Suddhasattwa Nad +2 more | 2024-07-02 |
| 11948848 | Subtractive etch resolution implementing a functional thin metal resist | Jeremy Ecton, Oscar Ojeda, Suddhasattwa Nad, Robert Alan May, Hiroki Tanaka +1 more | 2024-04-02 |
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Matthew Tingey, Oscar Ojeda, Hsin-Wei Wang +3 more | 2023-11-14 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more | 2023-08-08 |
| 11506982 | Prism-mask for angled patterning applications | Vahidreza Parichehreh, Keith J. Martin, Changhua Liu | 2022-11-22 |
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more | 2022-06-28 |
| 11088103 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Robert Alan May +1 more | 2021-08-10 |
| 10515824 | Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field | Jeremy Ecton, Nicholas S. Haehn, Hsin-Wei Wang, Oscar Ojeda, Arnab Roy | 2019-12-24 |
| 10078204 | Non-destructive 3-dimensional chemical imaging of photo-resist material | Nilanjan Ghosh, Kevin Thomas McCarthy, Zhiyong Wang, Deepak Goyal, Changhua Liu | 2018-09-18 |
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Gregory S. Constable, Sriram Srinivasan | 2017-11-07 |
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka | 2017-10-17 |
| 9659899 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Eric J. Li, Nitin A. Deshpande +2 more | 2017-05-23 |
| 9472519 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka | 2016-10-18 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Gregory S. Constable, Sriram Srinivasan | 2016-02-09 |
| 9123732 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Eric J. Li, Nitin A. Deshpande +2 more | 2015-09-01 |
| 9006887 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka | 2015-04-14 |
| 8674519 | Microelectronic package and method of manufacturing same | Edward R. Prack, Robert M. Nickerson | 2014-03-18 |
| 8592972 | Thermally conductive device with a thermal interface material | Lakshmi Supriya, Jessica Weninger, Lateef Mustapha | 2013-11-26 |
| 8569108 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Dingying Xu, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli | 2013-10-29 |