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First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xia Guo, Aleksandar Aleksov, Steve Cho, Robert A. May +1 more |
2025-10-28 |
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| 12449600 |
Position controlled waveguides and methods of manufacturing the same |
Jeremy Ecton, Whitney Bryks, Haobo Chen, Benjamin Duong, Changhua Liu +2 more |
2025-10-21 |
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| 12354992 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Robert Alan May +1 more |
2025-07-08 |
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| 12345932 |
Die last and waveguide last architecture for silicon photonic packaging |
Bai Nie, Pooya Tadayon, Yonggang Li, Changhua Liu, Kristof Darmawikarta +4 more |
2025-07-01 |
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| 12341117 |
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates |
Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more |
2025-06-24 |
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| 12334422 |
Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates |
Kyle McElhinny, Onur Ozkan, Ali Lehaf, Xiaoying Guo, Steve Cho +4 more |
2025-06-17 |
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| 12255130 |
Airgap structures for high speed signal integrity |
Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo +4 more |
2025-03-18 |
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| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
2024-07-09 |
$24,938,000 |
| 12027466 |
Conductive route patterning for electronic substrates |
Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Suddhasattwa Nad +2 more |
2024-07-02 |
$27,114,000 |
| 11948848 |
Subtractive etch resolution implementing a functional thin metal resist |
Jeremy Ecton, Oscar Ojeda, Suddhasattwa Nad, Robert Alan May, Hiroki Tanaka +1 more |
2024-04-02 |
$34,819,000 |
| 11817349 |
Conductive route patterning for electronic substrates |
Jeremy Ecton, Brandon C. Marin, Matthew Tingey, Oscar Ojeda, Hsin-Wei Wang +3 more |
2023-11-14 |
$31,444,000 |
| 11721631 |
Via structures having tapered profiles for embedded interconnect bridge substrates |
Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more |
2023-08-08 |
$22,376,000 |
| 11506982 |
Prism-mask for angled patterning applications |
Vahidreza Parichehreh, Keith J. Martin, Changhua Liu |
2022-11-22 |
$12,862,000 |
| 11373951 |
Via structures having tapered profiles for embedded interconnect bridge substrates |
Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more |
2022-06-28 |
$15,065,000 |
| 11088103 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Robert Alan May +1 more |
2021-08-10 |
$36,027,000 |
| 10515824 |
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field |
Jeremy Ecton, Nicholas S. Haehn, Hsin-Wei Wang, Oscar Ojeda, Arnab Roy |
2019-12-24 |
$26,956,000 |
| 10078204 |
Non-destructive 3-dimensional chemical imaging of photo-resist material |
Nilanjan Ghosh, Kevin Thomas McCarthy, Zhiyong Wang, Deepak Goyal, Changhua Liu |
2018-09-18 |
$29,867,000 |
| 9808875 |
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby |
Deepak Kulkarni, Carl Deppisch, Gregory S. Constable, Sriram Srinivasan |
2017-11-07 |
$13,901,000 |
| 9793233 |
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby |
Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka |
2017-10-17 |
$9,876,000 |
| 9659899 |
Die warpage control for thin die assembly |
Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Eric J. Li, Nitin A. Deshpande +2 more |
2017-05-23 |
$7,972,000 |
| 9472519 |
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby |
Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka |
2016-10-18 |
$9,528,000 |
| 9254532 |
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby |
Deepak Kulkarni, Carl Deppisch, Gregory S. Constable, Sriram Srinivasan |
2016-02-09 |
$15,927,000 |
| 9123732 |
Die warpage control for thin die assembly |
Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Eric J. Li, Nitin A. Deshpande +2 more |
2015-09-01 |
$13,376,000 |
| 9006887 |
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby |
Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka |
2015-04-14 |
$22,638,000 |
| 8674519 |
Microelectronic package and method of manufacturing same |
Edward R. Prack, Robert M. Nickerson |
2014-03-18 |
$15,232,000 |
