Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191161 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Oladeji Fadayomi, Jeremy Ecton | 2025-01-07 |
| 11948848 | Subtractive etch resolution implementing a functional thin metal resist | Jeremy Ecton, Leonel Arana, Suddhasattwa Nad, Robert Alan May, Hiroki Tanaka +1 more | 2024-04-02 |
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Leonel Arana, Matthew Tingey, Hsin-Wei Wang +3 more | 2023-11-14 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2023-08-08 |
| 11652036 | Via-trace structures | Jeremy Ecton, Hiroki Tanaka, Kristof Darmawikarta, Arnab Roy, Nicholas S. Haehn | 2023-05-16 |
| 11528811 | Method, device and system for providing etched metallization structures | Jeremy Ecton, Nicholas S. Haehn, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2022-12-13 |
| 11373951 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2022-06-28 |
| 11116084 | Method, device and system for providing etched metallization structures | Jeremy Ecton, Nicholas S. Haehn, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2021-09-07 |
| 10798817 | Method for making a flexible wearable circuit | Aleksandar Aleksov, Javier Soto Gonzalez, Meizi Jiao, Shruti R. Jaywant, Sashi S. Kandanur +4 more | 2020-10-06 |
| 10515824 | Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field | Jeremy Ecton, Leonel Arana, Nicholas S. Haehn, Hsin-Wei Wang, Arnab Roy | 2019-12-24 |
| 10438812 | Anisotropic etching systems and methods using a photochemically enhanced etchant | Jeremy Ecton, Changhua Liu, Arnab Roy, Timothy A. White, Nicholas S. Haehn | 2019-10-08 |