| 12481108 |
Faraday rotator interconnect as a through-via configuration in a patch architecture |
Brandon C. Marin, Divya Pratap, Hisato Tanaka, Nitin A. Deshpande, Omkar G. Karhade +5 more |
2025-11-25 |
|
| 12449600 |
Position controlled waveguides and methods of manufacturing the same |
Leonel Arana, Whitney Bryks, Haobo Chen, Benjamin Duong, Changhua Liu +2 more |
2025-10-21 |
|
| 12444672 |
Hybrid bonding technologies with thermal expansion compensation structures |
Aleksandar Aleksov, Hisato Tanaka, Brandon C. Marin, Srinivas V. Pietambaram, Xavier Francois Brun |
2025-10-14 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Omkar G. Karhade +5 more |
2025-09-23 |
|
| 12412868 |
Microelectronic assemblies including interconnects with different solder materials |
Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more |
2025-09-09 |
|
| 12394719 |
Methods and apparatus to increase glass core thickness |
Brandon C. Marin, Srinivas V. Pietambaram, Bai Nie |
2025-08-19 |
|
| 12353070 |
Glass interposer optical switching device and method |
Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Hari Mahalingam +1 more |
2025-07-08 |
|
| 12354883 |
Omni directional interconnect with magnetic fillers in mold matrix |
Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more |
2025-07-08 |
|
| 12306480 |
Glass interposer optical resonator device and method |
Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Rajeev Ranjan |
2025-05-20 |
|
| 12255130 |
Airgap structures for high speed signal integrity |
Hongxia Feng, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more |
2025-03-18 |
|
| 12255147 |
Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein |
Brandon C. Marin, Srinivas V. Pietambaram, Suddhasattwa Nad |
2025-03-18 |
|
| 12224103 |
Angled inductor with small form factor |
Brandon C. Marin, Suddhasattwa Nad, Matthew Tingey, Ravindranath V. Mahajan, Srinivas V. Pietambaram |
2025-02-11 |
|
| 12191161 |
Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors |
Oladeji Fadayomi, Oscar Ojeda |
2025-01-07 |
|
| 12074102 |
Structural elements for application specific electronic device packages |
Suddhasattwa Nad, Ravindranath V. Mahajan, Brandon C. Marin, Mohammad Mamunur Rahman |
2024-08-27 |
$26,513,000 |
| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Hongxia Feng, Tarek A. Ibrahim +9 more |
2024-07-09 |
$24,938,000 |
| 12027466 |
Conductive route patterning for electronic substrates |
Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana, Suddhasattwa Nad +2 more |
2024-07-02 |
$27,114,000 |
| 11948848 |
Subtractive etch resolution implementing a functional thin metal resist |
Oscar Ojeda, Leonel Arana, Suddhasattwa Nad, Robert Alan May, Hiroki Tanaka +1 more |
2024-04-02 |
$34,819,000 |
| 11942334 |
Microelectronic assemblies having conductive structures with different thicknesses |
Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh, Veronica Strong +1 more |
2024-03-26 |
$33,708,000 |
| 11855125 |
Capacitors with nanoislands on conductive plates |
Srinivas V. Pietambaram, Brandon C. Marin, Hiroki Tanaka, Frank Truong |
2023-12-26 |
$39,948,000 |
| 11817349 |
Conductive route patterning for electronic substrates |
Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda, Hsin-Wei Wang +3 more |
2023-11-14 |
$31,444,000 |
| 11791228 |
Method for forming embedded grounding planes on interconnect layers |
Brandon C. Marin, Kristof Darmawikarta, Roy Dittler, Darko Grujicic |
2023-10-17 |
$15,641,000 |
| 11721631 |
Via structures having tapered profiles for embedded interconnect bridge substrates |
Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more |
2023-08-08 |
$22,376,000 |
| 11721650 |
Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package |
Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Suddhasattwa Nad, Mohammad Mamunur Rahman |
2023-08-08 |
$22,376,000 |
| 11694898 |
Hybrid fine line spacing architecture for bump pitch scaling |
Suddhasattwa Nad, Bai Nie, Rahul N. Manepalli, Marcel Wall |
2023-07-04 |
|
| 11670504 |
Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives |
Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne |
2023-06-06 |
$21,341,000 |
