Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087700 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka | 2024-09-10 |
| 11942406 | Semiconductor packages with embedded interconnects | Kyu Oh Lee, Ravindranadh Eluri | 2024-03-26 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2024-03-19 |
| 11780210 | Glass dielectric layer with patterning | Jieying Kong, Gang Duan, Srinivas V. Pietambaram, Patrick QUACH | 2023-10-10 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Rahul Jain, Praneeth Akkinepally, Frank Truong | 2023-08-22 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Yonggang Li, Sameer Paital +4 more | 2023-08-15 |
| 11670504 | Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives | Jeremy Ecton, Brandon C. Marin, Andrew J. Brown | 2023-06-06 |
| 11637171 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Shivasubramanian Balasubramanian | 2023-04-25 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li | 2023-03-14 |
| 11571876 | Dielectric film with pressure sensitive microcapsules of adhesion promoter | Praneeth Akkinepally, Frank Truong | 2023-02-07 |
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2022-11-01 |
| 11393745 | Semiconductor packages with embedded interconnects | Kyu Oh Lee, Ravindranadh Eluri | 2022-07-19 |
| 11296186 | Package-integrated vertical capacitors and methods of assembling same | Brandon C. Marin, Praneeth Akkinepally, Whitney Bryks, Frank Truong | 2022-04-05 |
| 11081448 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka | 2021-08-03 |
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li | 2021-08-03 |
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Praneeth Akkinepally +3 more | 2021-04-20 |
| 10820437 | Flexible packaging for a wearable electronic device | Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Albert S. Lopez +4 more | 2020-10-27 |
| 10798817 | Method for making a flexible wearable circuit | Aleksandar Aleksov, Javier Soto Gonzalez, Meizi Jiao, Shruti R. Jaywant, Oscar Ojeda +4 more | 2020-10-06 |
| 10756161 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Shivasubramanian Balasubramanian | 2020-08-25 |
| 10586715 | Embedded circuit patterning feature selective electroless | Yonggang Li, Aritra Dhar, Jon M. Williams | 2020-03-10 |
| 10546916 | Package-integrated vertical capacitors and methods of assembling same | Brandon C. Marin, Praneeth Akkinepally, Whitney Bryks, Frank Truong | 2020-01-28 |
| 10327330 | Stretchable electronic assembly | Aleksandar Aleksov, Adel A. Elsherbini, Javier Soto Gonzalez, Shruti R. Jaywant, Sashi S. Kandanur +5 more | 2019-06-18 |
| 10290557 | Selective metallization of an integrated circuit (IC) substrate | Brandon C. Marin, Trina Ghosh Dastidar, Yonggang Li, Sirisha Chava | 2019-05-14 |
| 10204855 | Bendable and stretchable electronic devices and methods | Alejandro X. Levander, Tatyana N. Andryushchenko, David Staines, Mauro J. Kobrinsky, Aleksandar Aleksov +3 more | 2019-02-12 |
| 10111338 | Build-up high-aspect ratio opening | Frank Truong | 2018-10-23 |