Issued Patents All Time
Showing 25 most recent of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Leonel Arana +1 more | 2025-07-08 |
| 12354963 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2025-07-08 |
| 12334443 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2025-06-17 |
| 12300613 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2025-05-13 |
| 12253722 | Magneto-optical Kerr effect interconnects for photonic packaging | Hiroki Tanaka, Kristof Darmawikarta, Brandon C. Marin, Sri Ranga Sai Boyapati | 2025-03-18 |
| 12218069 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2025-02-04 |
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2025-02-04 |
| 12176223 | Integrated circuit package supports | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2024-12-24 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more | 2024-12-24 |
| 12148703 | EMIB patch on glass laminate substrate | Robert L. Sankman | 2024-11-19 |
| 12046560 | Microelectronic device with embedded die substrate on interposer | Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-07-23 |
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Wei-Lun Kane Jen, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Wei-Lun Kane Jen, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2024-06-18 |
| 11948848 | Subtractive etch resolution implementing a functional thin metal resist | Jeremy Ecton, Oscar Ojeda, Leonel Arana, Suddhasattwa Nad, Hiroki Tanaka +1 more | 2024-04-02 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Steve Cho +7 more | 2024-03-19 |
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2024-03-12 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11908802 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2024-02-20 |
| 11908821 | Sacrificial dielectric for lithographic via formation to enable via scaling in high density interconnect packaging | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Hiroki Tanaka | 2024-02-20 |
| 11901248 | Embedded die architecture and method of making | Robert L. Sankman, Rahul N. Manepalli, Srinivas V. Pietambaram, Bharat P. Penmecha | 2024-02-13 |
| 11901296 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2024-02-13 |
| 11894311 | Microelectronic device with embedded die substrate on interposer | Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2024-02-06 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Srinivas V. Pietambaram, Kristof Darmawikarta, Hiroki Tanaka, Rahul N. Manepalli, Sri Ranga Sai Boyapati | 2024-01-02 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Lauren A. Link, Andrew J. Brown +2 more | 2024-01-02 |
| 11854834 | Integrated circuit package supports | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2023-12-26 |