Issued Patents All Time
Showing 25 most recent of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more | 2025-09-23 |
| 12412842 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Debendra Mallik | 2025-09-09 |
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12406893 | Edge-aligned template structure for integrated circuit packages | Debendra Mallik, Nitin A. Deshpande | 2025-09-02 |
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2025-09-02 |
| 12399334 | Photonic integrated circuit packaging architectures | Xiaoqian Li, Nitin A. Deshpande | 2025-08-26 |
| 12392970 | Photonic integrated circuit packaging architectures | Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan, Srinivas V. Pietambaram, Bharat P. Penmecha +1 more | 2025-08-19 |
| 12386127 | Micro-lens array optically coupled with a photonics die | Xiaoqian Li, Nitin A. Deshpande | 2025-08-12 |
| 12366713 | Heat dissipation structures for optical communication devices | Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath V. Mahajan, Chia-Pin Chiu | 2025-07-22 |
| 12347780 | Integrated circuit package with flipped high bandwidth memory device | Krishna Vasanth Valavala, Chandra Mohan Jha, Andrew Collins | 2025-07-01 |
| 12334472 | Multiple wafer stack architecture to enable singulation | Sairam Agraharam | 2025-06-17 |
| 12327814 | Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity | Brandon C. Marin, Sai Vadlamani, Tolga Acikalin | 2025-06-10 |
| 12272650 | Microelectronic package with substrate cavity for bridge-attach | Debendra Mallik, Nitin A. Deshpande, Amruthavalli Pallavi Alur | 2025-04-08 |
| 12243792 | Microelectronic structures including bridges | Xiaoxuan Sun, Nitin A. Deshpande, Sairam Agraharam | 2025-03-04 |
| 12183596 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2024-12-31 |
| 12181710 | Photonic integrated circuit packaging architecture | Xiaoqian Li, Tarek A. Ibrahim, Ravindranath V. Mahajan, Nitin A. Deshpande | 2024-12-31 |
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi, Manish Dubey +1 more | 2024-12-24 |
| 12148744 | Optical multichip package with multiple system-on-chip dies | Zhichao Zhang, Kemal Aygun, Suresh Pothukuchi, Xiaoqian Li | 2024-11-19 |
| 12119326 | Microelectronic structures including bridges | Bohan Shan | 2024-10-15 |
| 12113023 | Microelectronic structures including bridges | Nitin A. Deshpande | 2024-10-08 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Edvin Cetegen, Nicholas S. Haehn, Vaibhav Agrawal +4 more | 2024-08-20 |
| 12061371 | Patch on interposer architecture for low cost optical co-packaging | Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan | 2024-08-13 |
| 12044888 | Silicon groove architectures and manufacturing processes for passive alignment in a photonics die | Xiaoqian Li, Nitin A. Deshpande, Sujit Sharan | 2024-07-23 |
| 12027448 | Open cavity bridge power delivery architectures and processes | Mitul Modi, Sairam Agraharam, Nitin A. Deshpande, Digvijay A. Raorane | 2024-07-02 |
| 12003023 | In-package 3D antenna | Zhenguo Jiang, Srichaitra Chavali, Zhichao Zhang, Jimin Yao, Stephen Andrew Smith +2 more | 2024-06-04 |