| 12506128 |
Package architecture of scalable compute wall having compute bricks with vertically stacked dies |
Sagar Suthram, Debendra Mallik, Wilfred Gomes, Pushkar Ranade, Nitin A. Deshpande +2 more |
2025-12-23 |
|
| 12506085 |
HBI die architecture with fiducial in street for no metal depopulation in active die |
Nitin A. Deshpande |
2025-12-23 |
|
| 12506127 |
Package architecture of photonic system with vertically stacked dies having planarized edges |
Sagar Suthram, Ravindranath V. Mahajan, Debendra Mallik, Wilfred Gomes, Pushkar Ranade +4 more |
2025-12-23 |
|
| 12504580 |
Reduced bridge structure for a photonic integrated circuit |
Chia-Pin Chiu, Kaveh Hosseini |
2025-12-23 |
|
| 12500132 |
Formation of a reconstituted circuit device using flow of a material by capillary action |
Nitin A. Deshpande |
2025-12-16 |
|
| 12481108 |
Faraday rotator interconnect as a through-via configuration in a patch architecture |
Brandon C. Marin, Divya Pratap, Hisato Tanaka, Nitin A. Deshpande, Robert A. May +5 more |
2025-11-25 |
|
| 12476174 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more |
2025-11-18 |
|
| 12469801 |
Moisture seal coating of hybrid bonded stacked die package assembly |
Debendra Mallik, Mohammad Enamul Kabir, Nitin A. Deshpande, Arnab Sarkar, Sairam Agraharam +3 more |
2025-11-11 |
|
| 12443058 |
On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real estate for effective thermal tuning |
Chia-Pin Chiu, Kaveh Hosseini, Tim Tri Hoang |
2025-10-14 |
|
| 12442982 |
Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR) in an open cavity photonic integrated circuit (OCPIC) |
Chia-Pin Chiu, Kaveh Hosseini, Tim Tri Hoang |
2025-10-14 |
|
| 12436413 |
Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC) |
Chia-Pin Chiu, Kaveh Hosseini, Tim Tri Hoang |
2025-10-07 |
|
| 12438093 |
Microelectronic structures including bridges |
Nitin A. Deshpande |
2025-10-07 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more |
2025-09-23 |
|
| 12412868 |
Microelectronic assemblies including interconnects with different solder materials |
Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more |
2025-09-09 |
|
| 12412842 |
Microelectronic structures including bridges |
Nitin A. Deshpande, Mohit Bhatia, Debendra Mallik |
2025-09-09 |
|
| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more |
2025-09-02 |
|
| 12406893 |
Edge-aligned template structure for integrated circuit packages |
Debendra Mallik, Nitin A. Deshpande |
2025-09-02 |
|
| 12399334 |
Photonic integrated circuit packaging architectures |
Xiaoqian Li, Nitin A. Deshpande |
2025-08-26 |
|
| 12392970 |
Photonic integrated circuit packaging architectures |
Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan, Srinivas V. Pietambaram, Bharat P. Penmecha +1 more |
2025-08-19 |
|
| 12386127 |
Micro-lens array optically coupled with a photonics die |
Xiaoqian Li, Nitin A. Deshpande |
2025-08-12 |
|
| 12366713 |
Heat dissipation structures for optical communication devices |
Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath V. Mahajan, Chia-Pin Chiu |
2025-07-22 |
|
| 12347780 |
Integrated circuit package with flipped high bandwidth memory device |
Krishna Vasanth Valavala, Chandra Mohan Jha, Andrew Collins |
2025-07-01 |
|
| 12334472 |
Multiple wafer stack architecture to enable singulation |
Sairam Agraharam |
2025-06-17 |
|
| 12327814 |
Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity |
Brandon C. Marin, Sai Vadlamani, Tolga Acikalin |
2025-06-10 |
|
| 12272650 |
Microelectronic package with substrate cavity for bridge-attach |
Debendra Mallik, Nitin A. Deshpande, Amruthavalli Pallavi Alur |
2025-04-08 |
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