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USPTO Patent Rankings Data through Dec 31, 2025
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Suresh Pothukuchi — 7 Patents

Intel: 5 patents #7,234 of 30,777Top 25%
Chandler, AZ: #789 of 3,331 inventorsTop 25%
Arizona: #5,272 of 32,909 inventorsTop 20%
Overall (All Time): #680,018 of 4,157,543Top 20%
7 Patents All Time
Suresh Pothukuchi has been granted 7 US patents while listed as an inventor at Intel. The first was granted in 2014 and the most recent in December 2025. Suresh Pothukuchi ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Suresh Pothukuchi in Chandler, AZ, US.

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12494403 Preserving access to optical components on a wafer package with sacrificial die Ankit Aggarwal, Subal Sahni, Anand Rathi 2025-12-09
12493155 Preserving access to optical components on a wafer package with sacrificial cap Ankit Aggarwal, Anand Rathi 2025-12-09
12148744 Optical multichip package with multiple system-on-chip dies Zhichao Zhang, Kemal Aygun, Xiaoqian Li, Omkar G. Karhade 2024-11-19 $25,575,000
11830863 Dual-sided co-packaged optics for high bandwidth networking applications Andrew C. Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more 2023-11-28 $31,872,000
11217573 Dual-sided co-packaged optics for high bandwidth networking applications Andrew C. Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more 2022-01-04 $22,100,000
9406618 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Mohit Mamodia +2 more 2016-08-02 $8,723,000
8786066 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Mohit Mamodia +2 more 2014-07-22 $29,002,000