Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148744 | Optical multichip package with multiple system-on-chip dies | Zhichao Zhang, Kemal Aygun, Xiaoqian Li, Omkar G. Karhade | 2024-11-19 |
| 11830863 | Dual-sided co-packaged optics for high bandwidth networking applications | Andrew C. Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more | 2023-11-28 |
| 11217573 | Dual-sided co-packaged optics for high bandwidth networking applications | Andrew C. Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more | 2022-01-04 |
| 9406618 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Mohit Mamodia +2 more | 2016-08-02 |
| 8786066 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Mohit Mamodia +2 more | 2014-07-22 |