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Home › Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

US Patent 8786066 · Granted Jul 22, 2014

Estimated economic value: $29,002,000 ⓘ

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