Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11223716 | Adaptive volume control using speech loudness gesture | Subramanyam Irukuvajhula, Satyanarayana Mantri | 2022-01-11 |
| 11189275 | Natural language processing while sound sensor is muted | Subramanyam Irukuvajhula | 2021-11-30 |
| 10652475 | Structured light 3D sensors with variable focal length lenses and illuminators | Raymond Kirk Price, Michael Bleyer, Jian Zhao, Denis Demandolx, Zhiqiang Liu | 2020-05-12 |
| 10602039 | Ultra-compact image sensor assembly for thin profile devices | Raymond Kirk Price | 2020-03-24 |
| 10521650 | 3D imaging recognition by stereo matching of RGB and infrared images | Raymond Kirk Price, Michael Bleyer, Jian Zhao | 2019-12-31 |
| 10469758 | Structured light 3D sensors with variable focal length lenses and illuminators | Raymond Kirk Price, Michael Bleyer, Jian Zhao, Denis Demandolx, Zhiqiang Liu | 2019-11-05 |
| 10430647 | Tailored illumination profile for articulated hand tracking | Raymond Kirk Price | 2019-10-01 |
| 10386486 | Systems and methods for time of flight laser pulse engineering | Raymond Kirk Price | 2019-08-20 |
| 10372974 | 3D imaging recognition by stereo matching of RGB and infrared images | Raymond Kirk Price, Michael Bleyer, Jian Zhao | 2019-08-06 |
| 10261328 | Enhanced illumination system | Raymond Kirk Price | 2019-04-16 |
| 10257932 | Laser diode chip on printed circuit board | David Mandelboum, Shlomo Felzenshtein, Boaz Shem-Tov, Raymond Kirk Price | 2019-04-09 |
| 10154197 | Image capture device having light field image capture mode, 2D image capture mode, and intermediate capture mode | Jerome Chandra Bhat, Brandon E. Clarke, Graham B. Myhre, Steven Oliver, Tony Poon +4 more | 2018-12-11 |
| 10051723 | High thermal conductivity region for optoelectronic devices | Raymond Kirk Price | 2018-08-14 |
| 10048498 | Illumination module | Raymond Kirk Price | 2018-08-14 |
| 10003726 | Illumination module for near eye-to-eye display system | Raymond Kirk Price | 2018-06-19 |
| 9929097 | Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers | Omar J. Bchir, Houssam Jomaa | 2018-03-27 |
| 9851478 | Optical cross talk mitigation for optical device having disrupting features formed on a shield | Raymond Kirk Price, Erica Lee Towle | 2017-12-26 |
| 9780054 | Semiconductor package with embedded die and its methods of fabrication | John S. Guzek, Javier Soto Gonzalez, Nicholas R. Watts | 2017-10-03 |
| 9769398 | Image sensor with large-area global shutter contact | Raymond Kirk Price | 2017-09-19 |
| 9726962 | Enhanced camera module mount | Michael Nikkhoo, Igor Markovsky | 2017-08-08 |
| 9411122 | Light field image capture device having 2D image capture mode | Jerome Chandra Bhat, Brandon E. Clarke, Graham B. Myhre, Steven Oliver, Tony Poon +3 more | 2016-08-09 |
| 9406618 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi, Mohit Mamodia +2 more | 2016-08-02 |
| 9257380 | Forming functionalized carrier structures with coreless packages | John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney, Hamid Azimi | 2016-02-09 |
| 9214439 | Forming in-situ micro-feature structures with coreless packages | Mathew J. Manusharow | 2015-12-15 |
| 9077901 | Light field image capture device having 2D image capture mode | Jerome Chandra Bhat, Brandon E. Clarke, Graham B. Myhre, Steven Oliver, Tony Poon +3 more | 2015-07-07 |