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Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Islam A. Salama, Charan Gurumurthy |
2019-05-28 |
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Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Islam A. Salama, Charan Gurumurthy |
2017-05-09 |
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Method of forming molded panel embedded die structure |
Rahul N. Manepalli, John S. Guzek |
2016-04-12 |
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Forming functionalized carrier structures with coreless packages |
Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney |
2016-02-09 |
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Forming functionalized carrier structures with coreless packages |
Ravi K. Nailla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney |
2015-03-24 |
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Forming functionalized carrier structures with coreless packages |
Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney |
2013-12-31 |
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Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
Yonggang Li, Islam A. Salama, Charan Gurumurthy |
2013-05-14 |
| 8035218 |
Microelectronic package and method of manufacturing same |
John S. Guzek, Mahadevan Survakumar |
2011-10-11 |
| 7985622 |
Method of forming collapse chip connection bumps on a semiconductor substrate |
Ravi Kiran Nalla, Islam A. Salama, Charan Gurumurthy |
2011-07-26 |
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Method of forming copper layers |
Debabrata Gupta, Saliya Witharana |
2008-08-19 |
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Integrated circuit die/package interconnect |
Gilroy Vandentop |
2008-02-12 |
| 7042077 |
Integrated circuit package with low modulus layer and capacitor/interposer |
Michael Walk, John S. Guzek, Charan Gurumurthy |
2006-05-09 |
| 7005727 |
Low cost programmable CPU package/substrate |
Debabrata Gupta, Saliya Witharana |
2006-02-28 |
| 6858475 |
Method of forming an integrated circuit substrate |
Charan Gurumurthy, Arthur Lin |
2005-02-22 |
| 6600233 |
Integrated circuit package with surface mounted pins on an organic substrate |
Hwai-Peng Yeoh, Amir Nur Rashid Wagiman, Mirng-Ji Lii |
2003-07-29 |
| 6430058 |
Integrated circuit package |
Bob Sankman |
2002-08-06 |
| 6413849 |
Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor |
Hwai-Peng Yeoh, Amir Wagiman, Mirng-Ji Lii |
2002-07-02 |