Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10306760 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Islam A. Salama, Charan Gurumurthy | 2019-05-28 |
| 9648733 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Islam A. Salama, Charan Gurumurthy | 2017-05-09 |
| 9312233 | Method of forming molded panel embedded die structure | Rahul N. Manepalli, John S. Guzek | 2016-04-12 |
| 9257380 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney | 2016-02-09 |
| 8987065 | Forming functionalized carrier structures with coreless packages | Ravi K. Nailla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney | 2015-03-24 |
| 8618652 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney | 2013-12-31 |
| 8440916 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Yonggang Li, Islam A. Salama, Charan Gurumurthy | 2013-05-14 |
| 8035218 | Microelectronic package and method of manufacturing same | John S. Guzek, Mahadevan Survakumar | 2011-10-11 |
| 7985622 | Method of forming collapse chip connection bumps on a semiconductor substrate | Ravi Kiran Nalla, Islam A. Salama, Charan Gurumurthy | 2011-07-26 |
| 7413936 | Method of forming copper layers | Debabrata Gupta, Saliya Witharana | 2008-08-19 |
| 7330357 | Integrated circuit die/package interconnect | Gilroy Vandentop | 2008-02-12 |
| 7042077 | Integrated circuit package with low modulus layer and capacitor/interposer | Michael Walk, John S. Guzek, Charan Gurumurthy | 2006-05-09 |
| 7005727 | Low cost programmable CPU package/substrate | Debabrata Gupta, Saliya Witharana | 2006-02-28 |
| 6858475 | Method of forming an integrated circuit substrate | Charan Gurumurthy, Arthur Lin | 2005-02-22 |
| 6600233 | Integrated circuit package with surface mounted pins on an organic substrate | Hwai-Peng Yeoh, Amir Nur Rashid Wagiman, Mirng-Ji Lii | 2003-07-29 |
| 6430058 | Integrated circuit package | Bob Sankman | 2002-08-06 |
| 6413849 | Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor | Hwai-Peng Yeoh, Amir Wagiman, Mirng-Ji Lii | 2002-07-02 |