Hamid Azimi — 17 Patents at Intel

Hamid Azimi has been granted 17 US patents while listed as an inventor at Intel. The first was granted in 2002 and the most recent in May 2019. Hamid Azimi ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Hamid Azimi in Chandler, AZ, US.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10306760	Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method	Yonggang Li, Islam A. Salama, Charan Gurumurthy	2019-05-28	$17,387,000
9648733	Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method	Yonggang Li, Islam A. Salama, Charan Gurumurthy	2017-05-09	$10,144,000
9312233	Method of forming molded panel embedded die structure	Rahul N. Manepalli, John S. Guzek	2016-04-12	$10,096,000
9257380	Forming functionalized carrier structures with coreless packages	Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney	2016-02-09	$15,927,000
8987065	Forming functionalized carrier structures with coreless packages	Ravi K. Nailla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney	2015-03-24	$15,411,000
8618652	Forming functionalized carrier structures with coreless packages	Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney	2013-12-31	$14,080,000
8440916	Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method	Yonggang Li, Islam A. Salama, Charan Gurumurthy	2013-05-14	$17,697,000
8035218	Microelectronic package and method of manufacturing same	John S. Guzek, Mahadevan Survakumar	2011-10-11	$25,057,000
7985622	Method of forming collapse chip connection bumps on a semiconductor substrate	Ravi Kiran Nalla, Islam A. Salama, Charan Gurumurthy	2011-07-26	$21,887,000
7413936	Method of forming copper layers	Debabrata Gupta, Saliya Witharana	2008-08-19	$22,118,000
7330357	Integrated circuit die/package interconnect	Gilroy Vandentop	2008-02-12	$36,180,000
7042077	Integrated circuit package with low modulus layer and capacitor/interposer	Michael Walk, John S. Guzek, Charan Gurumurthy	2006-05-09	$14,660,000
7005727	Low cost programmable CPU package/substrate	Debabrata Gupta, Saliya Witharana	2006-02-28	$11,249,000
6858475	Method of forming an integrated circuit substrate	Charan Gurumurthy, Arthur Lin	2005-02-22	$35,388,000
6600233	Integrated circuit package with surface mounted pins on an organic substrate	Hwai-Peng Yeoh, Amir Nur Rashid Wagiman, Mirng-Ji Lii	2003-07-29	$49,479,000
6430058	Integrated circuit package	Bob Sankman	2002-08-06	$50,822,000
6413849	Integrated circuit package with surface mounted pins on an organic substrate and method of fabrication therefor	Hwai-Peng Yeoh, Amir Wagiman, Mirng-Ji Lii	2002-07-02	$178,843,000

Hamid Azimi — 17 Patents

Issued Patents All Time

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