Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7413936 | Method of forming copper layers | Hamid Azimi, Debabrata Gupta | 2008-08-19 |
| 7005727 | Low cost programmable CPU package/substrate | Hamid Azimi, Debabrata Gupta | 2006-02-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7413936 | Method of forming copper layers | Hamid Azimi, Debabrata Gupta | 2008-08-19 |
| 7005727 | Low cost programmable CPU package/substrate | Hamid Azimi, Debabrata Gupta | 2006-02-28 |