Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496236 | Interconnect structure | Yukio Hashimoto, Ilyas Mohammed, Laura Wills Mirkarimi, Rajesh Katkar | 2016-11-15 |
| 8853558 | Interconnect structure | Yukio Hashimoto, Ilyas Mohammed, Laura Wills Mirkarimi, Rajesh Katkar | 2014-10-07 |
| 7535728 | Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors | Kishore K. Chakravorty, Paul H. Wermer, David G. Figueroa | 2009-05-19 |
| 7413936 | Method of forming copper layers | Hamid Azimi, Saliya Witharana | 2008-08-19 |
| 7120031 | Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors | Kishore K. Chakravorty, Paul H. Wermer, David G. Figueroa | 2006-10-10 |
| 7005727 | Low cost programmable CPU package/substrate | Hamid Azimi, Saliya Witharana | 2006-02-28 |
| 6775150 | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture | Kishore K. Chakravorty, Paul H. Wermer, David G. Figueroa | 2004-08-10 |
| 5567648 | Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs | — | 1996-10-22 |
| 5451274 | Reflow of multi-layer metal bumps | — | 1995-09-19 |
| 5341979 | Method of bonding a semiconductor substrate to a support substrate and structure therefore | — | 1994-08-30 |
| 5198963 | Multiple integrated circuit module which simplifies handling and testing | James E. Drye | 1993-03-30 |
| 4773469 | Composite mold for continuous thin strip casting | Harvey P. Cheskis | 1988-09-27 |
| 4564390 | Decarburizing a metal or metal alloy melt | John C. Yarwood | 1986-01-14 |
| 4472195 | Process for decarburizing alloy melts | John C. Yarwood | 1984-09-18 |