Debabrata Gupta has been granted 14 US patents while listed as an inventor at Intel . The first was granted in 1984 and the most recent in November 2016. Debabrata Gupta ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Debabrata Gupta in Scottsdale, AZ, US.
Patents per Year Patents granted per year, 1984 to 2016 Bar chart with a peak of 2 patents in 2006. peak 2 1984: 1 patents 1984 1986: 1 patents 1988: 1 patents 1988 1993: 1 patents 1994: 1 patents 1994 1995: 1 patents 1996: 1 patents 1996 2004: 1 patents 2006: 2 patents 2006 2008: 1 patents 2009: 1 patents 2009 2014: 1 patents 2016: 1 patents 2016
Issued Patents All Time
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Showing 1–14 of 14 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
9496236 Interconnect structure Yukio Hashimoto , Ilyas Mohammed , Laura Wills Mirkarimi , Rajesh Katkar 2016-11-15
$10,656,000
8853558 Interconnect structure Yukio Hashimoto , Ilyas Mohammed , Laura Wills Mirkarimi , Rajesh Katkar 2014-10-07
$4,726,000
7535728 Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors Kishore K. Chakravorty , Paul H. Wermer , David G. Figueroa 2009-05-19
$16,372,000
7413936 Method of forming copper layers Hamid Azimi , Saliya Witharana 2008-08-19
$22,118,000
7120031 Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors Kishore K. Chakravorty , Paul H. Wermer , David G. Figueroa 2006-10-10
$14,351,000
7005727 Low cost programmable CPU package/substrate Hamid Azimi , Saliya Witharana 2006-02-28
$11,249,000
6775150 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture Kishore K. Chakravorty , Paul H. Wermer , David G. Figueroa 2004-08-10
$15,945,000
5567648 Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs — 1996-10-22
$16,059,000
5451274 Reflow of multi-layer metal bumps — 1995-09-19
$11,000,000
5341979 Method of bonding a semiconductor substrate to a support substrate and structure therefore — 1994-08-30
$14,010,000
5198963 Multiple integrated circuit module which simplifies handling and testing James E. Drye 1993-03-30
$8,477,000
4773469 Composite mold for continuous thin strip casting Harvey P. Cheskis 1988-09-27
$2,860,000
4564390 Decarburizing a metal or metal alloy melt John C. Yarwood 1986-01-14
$4,472,000
4472195 Process for decarburizing alloy melts John C. Yarwood 1984-09-18
$1,060,000
