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Interconnect structure |
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| 8853558 |
Interconnect structure |
Yukio Hashimoto, Ilyas Mohammed, Laura Wills Mirkarimi, Rajesh Katkar |
2014-10-07 |
| 7535728 |
Electronic assemblies comprising ceramic/organic hybrid substrate with embedded capacitors |
Kishore K. Chakravorty, Paul H. Wermer, David G. Figueroa |
2009-05-19 |
| 7413936 |
Method of forming copper layers |
Hamid Azimi, Saliya Witharana |
2008-08-19 |
| 7120031 |
Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors |
Kishore K. Chakravorty, Paul H. Wermer, David G. Figueroa |
2006-10-10 |
| 7005727 |
Low cost programmable CPU package/substrate |
Hamid Azimi, Saliya Witharana |
2006-02-28 |
| 6775150 |
Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
Kishore K. Chakravorty, Paul H. Wermer, David G. Figueroa |
2004-08-10 |
| 5567648 |
Process for providing interconnect bumps on a bonding pad by application of a sheet of conductive discs |
— |
1996-10-22 |
| 5451274 |
Reflow of multi-layer metal bumps |
— |
1995-09-19 |
| 5341979 |
Method of bonding a semiconductor substrate to a support substrate and structure therefore |
— |
1994-08-30 |
| 5198963 |
Multiple integrated circuit module which simplifies handling and testing |
James E. Drye |
1993-03-30 |
| 4773469 |
Composite mold for continuous thin strip casting |
Harvey P. Cheskis |
1988-09-27 |
| 4564390 |
Decarburizing a metal or metal alloy melt |
John C. Yarwood |
1986-01-14 |
| 4472195 |
Process for decarburizing alloy melts |
John C. Yarwood |
1984-09-18 |
