Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7969164 | Method and apparatus for mini module EMI shielding evaluation | Jinbang Tang, Scott M. Hayes | 2011-06-28 |
| 6906406 | Multiple dice package | Lih-Tyng Hwang, Shun-Meen Kuo | 2005-06-14 |
| 5198963 | Multiple integrated circuit module which simplifies handling and testing | Debabrata Gupta | 1993-03-30 |
| 5164885 | Electronic package having a non-oxide ceramic bonded to metal and method for making | David Reed, Vern H. Winchell, II | 1992-11-17 |
| 4890156 | Multichip IC module having coplanar dice and substrate | Steven L. Post | 1989-12-26 |
| 4800421 | Glass bonding means and method | Earl K. Davis, David Reed | 1989-01-24 |
| 4792533 | Coplanar die to substrate bond method | Steven L. Post | 1988-12-20 |
| 4722914 | Method of making a high density IC module assembly | Jack A. Schroeder, Vern H. Winchell, II | 1988-02-02 |
| 4630096 | High density IC module assembly | Jack A. Schroeder, Vern H. Winchell, II | 1986-12-16 |
| 4592794 | Glass bonding method | Earl K. Davis, David Reed | 1986-06-03 |
| 4515898 | Glass bonding means and method | Earl K. Davis, David Reed | 1985-05-07 |