Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327959 | Compact connectors with integrated wireless communication elements | — | 2025-06-10 |
| 12176307 | Waveguide launcher in package based on high dielectric constant carrier | — | 2024-12-24 |
| 12027485 | Semiconductor device assembly and method therefor | — | 2024-07-02 |
| 11862584 | High dielectric constant carrier based packaging with enhanced WG matching for 5G and 6G applications | — | 2024-01-02 |
| 11557565 | Semiconductor device assembly and method therefor | — | 2023-01-17 |
| 11502054 | Semiconductor device assembly and method therefor | — | 2022-11-15 |
| 11427464 | Packaged pressure sensor device | Weng F. Yap, Sandeep Shantaram | 2022-08-30 |
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Zhiwei Gong, Betty Hill-Shan Yeung, Michael B. Vincent | 2021-09-14 |
| 11101542 | Integrated radio package having a built-in multi directional antenna array | — | 2021-08-24 |
| 10822224 | Packaged pressure sensor device | Weng F. Yap, Sandeep Shantaram | 2020-11-03 |
| 10319689 | Antenna assembly for wafer level packaging | Weng F. Yap | 2019-06-11 |
| 10134660 | Semiconductor device having corrugated leads and method for forming | Aruna Manoharan, Norman L. Owens, Gary Carl Johnson | 2018-11-20 |
| 9714879 | Electrically conductive barriers for integrated circuits | Chad S. Dawson, Andrew C. McNeil | 2017-07-25 |
| 9666930 | Interface between a semiconductor die and a waveguide, where the interface is covered by a molding compound | Neil T. Tracht | 2017-05-30 |
| 9172143 | Electronic device module with integrated antenna structure, and related manufacturing method | — | 2015-10-27 |
| 9029202 | Method of forming a high thermal conducting semiconductor device package | Weng F. Yap | 2015-05-12 |
| 8530346 | Process of forming an electronic device including a conductive stud over a bonding pad region | Lakshmi N. Ramanathan, Tien-Yu Lee | 2013-09-10 |
| 8461657 | Methods for forming a micro electro-mechanical device | Lianjun Liu | 2013-06-11 |
| 8407890 | Method of manufacting an electronic device module with integrated antenna structure | — | 2013-04-02 |
| 8385084 | Shielding structures for signal paths in electronic devices | Jong-Kai Lin, Ronald V. McBean | 2013-02-26 |
| 8330239 | Shielding for a micro electro-mechanical device and method therefor | Lianjun Liu | 2012-12-11 |
| 8293588 | Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer | — | 2012-10-23 |
| 8290736 | Calibration standards and methods of their fabrication and use | — | 2012-10-16 |
| 8283764 | Microelectronic assembly with an embedded waveguide adapter and method for forming the same | — | 2012-10-09 |
| 8168464 | Microelectronic assembly with an embedded waveguide adapter and method for forming the same | — | 2012-05-01 |