Issued Patents All Time
Showing 25 most recent of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Zhiwei Gong, Rushik P. Tank, Kabir Mirpuri, Betty Hill-Shan Yeung | 2025-09-02 |
| 12406949 | Semiconductor device with RF interposer and method therefor | — | 2025-09-02 |
| 12381164 | Semiconductor device with enclosed cavity and method therefor | Scott M. Hayes | 2025-08-05 |
| 12322719 | Semiconductor device structure and method therefor | — | 2025-06-03 |
| 12288766 | Semiconductor device with open cavity and method therefor | Scott M. Hayes | 2025-04-29 |
| 12288927 | Semiconductor device with low loss waveguide interface and method therefor | Giorgio Carluccio | 2025-04-29 |
| 12243842 | Semiconductor device with open cavity and method therefor | Scott M. Hayes | 2025-03-04 |
| 12125716 | Semiconductor device packaging warpage control | Zhiwei Gong, Scott M. Hayes, Vivek Gupta, Richard Te Gan | 2024-10-22 |
| 12033950 | Semiconductor device with self-aligned waveguide and method therefor | Scott M. Hayes, Antonius Hendrikus Jozef Kamphuis | 2024-07-09 |
| 11961776 | Semiconductor device with connector in package and method therefor | Scott M. Hayes | 2024-04-16 |
| 11963291 | Efficient wave guide transition between package and PCB using solder wall | Leo van Gemert | 2024-04-16 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |
| 11876059 | Semiconductor device with directing structure and method therefor | Robert J. Wenzel | 2024-01-16 |
| 11837560 | Semiconductor device with waveguide and method therefor | Giorgio Carluccio, Maristella Spella, Scott M. Hayes | 2023-12-05 |
| 11823968 | Semiconductor device package having stress isolation and method therefor | Scott M. Hayes, Stephen R. Hooper | 2023-11-21 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Zhiwei Gong, Kabir Mirpuri, Rushik P. Tank, Betty Hill-Shan Yeung | 2023-11-14 |
| 11791283 | Semiconductor device packaging warpage control | Scott M. Hayes, Zhiwei Gong, Richard Te Gan, Vivek Gupta | 2023-10-17 |
| 11777204 | Package | Giorgio Carluccio, Maristella Spella, Antonius Johannes Matheus de Graauw, Harshitha Thippur Shivamurthy | 2023-10-03 |
| 11760623 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Scott M. Hayes, Julien Juéry | 2023-09-19 |
| 11749624 | Semiconductor device and method | Abdellatif Zanati | 2023-09-05 |
| 11728285 | Semiconductor device packaging warpage control | Vivek Gupta, Scott M. Hayes, Richard Te Gan, Zhiwei Gong | 2023-08-15 |
| 11705410 | Semiconductor device having integrated antenna and method therefor | Vivek Gupta, Richard Te Gan, Kabir Mirpuri | 2023-07-18 |
| 11631625 | Topside heatsinking antenna launcher for an integrated circuit package | Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella | 2023-04-18 |
| 11557544 | Semiconductor device having a translation feature and method therefor | Giorgio Carluccio, Scott M. Hayes | 2023-01-17 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Scott M. Hayes, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2023-01-17 |