Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125716 | Semiconductor device packaging warpage control | Zhiwei Gong, Scott M. Hayes, Michael B. Vincent, Vivek Gupta | 2024-10-22 |
| 11967507 | Tie bar removal for semiconductor device packaging | Rushik P. Tank, Zhiwei Gong, Burton J. Carpenter, Jinmei Liu | 2024-04-23 |
| 11791283 | Semiconductor device packaging warpage control | Scott M. Hayes, Michael B. Vincent, Zhiwei Gong, Vivek Gupta | 2023-10-17 |
| 11728285 | Semiconductor device packaging warpage control | Vivek Gupta, Michael B. Vincent, Scott M. Hayes, Zhiwei Gong | 2023-08-15 |
| 11705410 | Semiconductor device having integrated antenna and method therefor | Michael B. Vincent, Vivek Gupta, Kabir Mirpuri | 2023-07-18 |
| 11404288 | Semiconductor device packaging warpage control | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong, Vivek Gupta | 2022-08-02 |
| 11222790 | Tie bar removal for semiconductor device packaging | Rushik P. Tank, Zhiwei Gong, Burton J. Carpenter, Jinmei Liu | 2022-01-11 |
| 10192837 | Multi-via redistribution layer for integrated circuits having solder balls | CHUNG-HSIUNG HO, Wayne Hsiao, James Spehar | 2019-01-29 |
| 9881863 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng +1 more | 2018-01-30 |
| 9589875 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng +1 more | 2017-03-07 |
| 9136142 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng +1 more | 2015-09-15 |
| 8716873 | Semiconductor packages and methods of packaging semiconductor devices | Chuen Khiang Wang, Nathapong Suthiwongsunthorn, Kriangsak Sae Le, Antonio Jr B Dimaano, Catherine Bee Liang Ng +1 more | 2014-05-06 |
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Roel Adeva Robles, Danny Retuta, Mary Annie Cheong, Hien Boon Tan, Anthony Yi Sheng Sun | 2011-10-04 |