Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842792 | Method of producing a semiconductor package | Danny Retuta, Hien Boon Tan, Anthony Yi Sheng Sun | 2017-12-12 |
| 9281218 | Method of producing a semiconductor package | Danny Retuta, Hien Boon Tan, Anthony Yi Sheng Sun | 2016-03-08 |
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Roel Adeva Robles, Danny Retuta, Hien Boon Tan, Anthony Yi Sheng Sun, Richard Te Gan | 2011-10-04 |
| 7723833 | Stacked die packages | Gaurav Mehta, Hien Boon Tan, Susanto Tanary, Anthony Yi Sheng Sun, Chuen Khiang Wang | 2010-05-25 |