Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842792 | Method of producing a semiconductor package | Danny Retuta, Hien Boon Tan, Mary Annie Cheong | 2017-12-12 |
| 9281218 | Method of producing a semiconductor package | Danny Retuta, Hien Boon Tan, Mary Annie Cheong | 2016-03-08 |
| 8793029 | Systems and methods for controlling energy consumption | Andrew T. Fausak, Darren Ybarra | 2014-07-29 |
| 8239073 | Systems and methods for controlling energy consumption | Andrew T. Fausak, Darren Ybarra | 2012-08-07 |
| 8129222 | High density chip scale leadframe package and method of manufacturing the package | Hien Boon Tan | 2012-03-06 |
| 8115292 | Interposer for semiconductor package | Chin Hock Toh, Yao Huang Huang, Ravi Kanth Kolan, Wei Liang Yuan, Susanto Tanary | 2012-02-14 |
| 8030768 | Semiconductor package with under bump metallization aligned with open vias | Roel Adeva Robles, Danny Retuta, Mary Annie Cheong, Hien Boon Tan, Richard Te Gan | 2011-10-04 |
| 7948095 | Semiconductor package and method of making the same | Catherine Bee Liang Ng, Chin Hock Toh | 2011-05-24 |
| 7830006 | Structurally-enhanced integrated circuit package and method of manufacture | Ravi Kanth Kolan, Hien Boon Tan, Beng Kuan Lim, Krishnamoorthi Sivalingam | 2010-11-09 |
| 7816775 | Multi-die IC package and manufacturing method | Chuen Khiang Wang, Hao Liu, Hien Boon Tan, Clifton Teik Lyk Law, Rahamat Bidin | 2010-10-19 |
| 7723833 | Stacked die packages | Gaurav Mehta, Hien Boon Tan, Susanto Tanary, Mary Annie Cheong, Chuen Khiang Wang | 2010-05-25 |
| 7678610 | Semiconductor chip package and method of manufacture | Chuen Khiang Wang, Hien Boon Tan, Sin Nee Song, Steven Yu Feng Yao, Hua Tan | 2010-03-16 |
| 7476569 | Leadframe enhancement and method of producing a multi-row semiconductor package | Danny Retuta, Hien Boon Tan, Susanto Tanary, Soon Huat Tan | 2009-01-13 |
| 7375416 | Leadframe enhancement and method of producing a multi-row semiconductor package | Danny Retuta, Hien Boon Tan, Susanto Tanary, Soon Huat Tan | 2008-05-20 |
| 7361995 | Molded high density electronic packaging structure for high performance applications | Kim-Yong Goh, Rahul Kapoor, Desmond Yok Rue Chong, Lan H. Hoang | 2008-04-22 |
| 7345357 | High density chip scale leadframe package and method of manufacturing the package | Hien Boon Tan | 2008-03-18 |
| 7323769 | High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package | Hien Boon Tan, Francis Poh | 2008-01-29 |
| 7307775 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satayadev Patel, Andrew Huibers, Steve S. Chiang, Robert M. Duboc, Jr., Thomas J. Grobelny +4 more | 2007-12-11 |