Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978334 | Sealing structure for workpiece to substrate bonding in a processing chamber | Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Arvind Sundarrajan, Seshadri Ramaswami | 2021-04-13 |
| 9954051 | Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiring | Guan Huei See, Glen T. Mori, Arvind Sundarrajan | 2018-04-24 |
| 9704726 | Packaging structural member | Yi-Sheng Anthony Sun, Xue Ren Zhang, Ravi Kanth Kolan | 2017-07-11 |
| 9219044 | Patterned photoresist to attach a carrier wafer to a silicon device wafer | Aksel Kitowski, Uday Mahajan, Thean Ming Tan | 2015-12-22 |
| 9202801 | Thin substrate and mold compound handling using an electrostatic-chucking carrier | Uday Mahajan, Aksel Kitowski | 2015-12-01 |
| 9142487 | Packaging structural member | Yi-Sheng Anthony Sun, Xue Ren Zhang, Ravi Kanth Kolan | 2015-09-22 |
| 9117808 | Semiconductor packages and methods of packaging semiconductor devices | Kriangsak Sae Le | 2015-08-25 |
| 8772921 | Interposer for semiconductor package | Yao Huang Huang, Ravi Kanth Kolan, Wei Liang Yuan, Susanto Tanary, Yi-Sheng Anthony Sun | 2014-07-08 |
| 8741762 | Through silicon via dies and packages | Hao Liu, Yi-Sheng Anthony Sun, Ravi Kanth Kolan | 2014-06-03 |
| 8703534 | Semiconductor packages and methods of packaging semiconductor devices | Kriangsak Sae Le | 2014-04-22 |
| 8647924 | Semiconductor package and method of packaging semiconductor devices | Keng Yuen Au, Reynaldo Vincent H. Sta Agueda, Bee Liang Catherine Ng, Librado Gatbonton, Xue Ren Zhang +1 more | 2014-02-11 |
| 8586465 | Through silicon via dies and packages | Hao Liu, Yi-Sheng Anthony Sun, Ravi Kanth Kolan | 2013-11-19 |
| 8426246 | Vented die and package | Hao Liu, Ravi Kanth Kolan | 2013-04-23 |
| 8399985 | Mold design and semiconductor package | Ravi Kanth Kolan, Hao Liu | 2013-03-19 |
| 8384203 | Packaging structural member | Yi-Sheng Anthony Sun, Xue Ren Zhang, Ravi Kanth Kolan | 2013-02-26 |
| 8143719 | Vented die and package | Hao Liu, Ravi Kanth Kolan | 2012-03-27 |
| 8115292 | Interposer for semiconductor package | Yao Huang Huang, Ravi Kanth Kolan, Wei Liang Yuan, Susanto Tanary, Anthony Yi Sheng Sun | 2012-02-14 |
| 8030761 | Mold design and semiconductor package | Ravi Kanth Kolan, Hao Liu | 2011-10-04 |
| 7948095 | Semiconductor package and method of making the same | Catherine Bee Liang Ng, Anthony Yi Sheng Sun | 2011-05-24 |