SR

Seshadri Ramaswami

Applied Materials: 33 patents #326 of 7,310Top 5%
AM AMD: 6 patents #1,863 of 9,279Top 25%
Overall (All Time): #80,670 of 4,157,543Top 2%
39
Patents All Time

Issued Patents All Time

Showing 25 most recent of 39 patents

Patent #TitleCo-InventorsDate
12262559 Monolithic complementary field-effect transistors having carbon-doped release layers Andrew Cockburn, Vanessa Pena, Daniel Philippe Cellier, John Tolle, Thomas Kirschenheiter +3 more 2025-03-25
12211947 Copper, indium, gallium, selenium (CIGS) films with improved quantum efficiency Philip Hsin-hua Li 2025-01-28
11728449 Copper, indium, gallium, selenium (CIGS) films with improved quantum efficiency Philip Hsin-hua Li 2023-08-15
11094573 Method and apparatus for thin wafer carrier Jingyu Qiao, Qiwei Liang, Viachslav Babayan, Srinivas D. Nemani 2021-08-17
11088293 Methods and apparatus for producing copper-indium-gallium-selenium (CIGS) film Philip Hsin-hua Li 2021-08-10
11018275 Method of creating CIGS photodiode for image sensor applications Philip Hsin-hua Li 2021-05-25
10978334 Sealing structure for workpiece to substrate bonding in a processing chamber Chin Hock Toh, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Jen Sern Lew, Arvind Sundarrajan 2021-04-13
10879094 Electrostatic chucking force measurement tool for process chamber carriers Srinivas D. Nemani, Gautam Pisharody, Shambhu N. Roy, Niranjan Kumar 2020-12-29
10665494 Automated apparatus to temporarily attach substrates to carriers without adhesives for processing Niranjan Kumar, Shay Assaf, Amikam Sade, Andy Constant, Maureen Frances Breiling 2020-05-26
9502294 Method and system for wafer level singulation Klaus Schuegraf, Michael R. Rice, Mohsen Salek, Claes Bjorkman 2016-11-22
8940619 Method of diced wafer transportation Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Saravjeet Singh, Todd Egan +1 more 2015-01-27
8580615 Method and system for wafer level singulation Klaus Schuegraf, Michael R. Rice, Mohsen Salek, Claes Bjorkman 2013-11-12
6899799 Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma Kenny King-Tai Ngan, Ying HUI 2005-05-31
6627542 Continuous, non-agglomerated adhesion of a seed layer to a barrier layer Srinivas Gandikota, Rong Tao, Liang-Yuh Chen 2003-09-30
6599399 Sputtering method to generate ionized metal plasma using electron beams and magnetic field Zheng Xu 2003-07-29
6521107 Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life Murali Abburi 2003-02-18
6475356 Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma Ken Ngan, Simon Wing-Lok Hui 2002-11-05
6472867 Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life Murali Abburi 2002-10-29
6455921 Fabricating plug and near-zero overlap interconnect line Jaim Nulman 2002-09-24
6436207 Manufacture of target for use in magnetron sputtering of nickel and like magnetic metals for forming metallization films having consistent uniformity through life Murali Abburi 2002-08-20
6420260 Ti/Tinx underlayer which enables a highly <111> oriented aluminum interconnect Kenny King-Tai Ngan 2002-07-16
6391163 Method of enhancing hardness of sputter deposited copper films Vikram Pavate, Murali Abburi, Murali Narasimhan 2002-05-21
6228186 Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies Vikram Pavate, Keith J. Hansen, Glen T. Mori, Murali Narasimhan, Jaim Nulman 2001-05-08
6171455 Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target Vikram Pavate, Keith J. Hansen, Glen T. Mori, Murali Narasimhan, Jaim Nulman 2001-01-09
6149777 Method of producing smooth titanium nitride films having low resistivity Kenny King-Tai Ngan 2000-11-21