| 12482652 |
Method for forming integrated circuit structures |
Bhargav S. Citla, Joshua Rubnitz, Jethro Tannos, Kartik Ramaswamy, Yang Yang |
2025-11-25 |
|
| 12476105 |
Directional selective fill for silicon gap fill processes |
Taiki Hatakeyama, Bhargav S. Citla, Qiang Ma, Biao Liu |
2025-11-18 |
|
| 12347674 |
Directional selective deposition |
Bhargav S. Citla, Soham Asrani, Joshua Rubnitz, Ellie Yieh |
2025-07-01 |
|
| 12315718 |
Forming films with improved film quality |
Bhargav S. Citla, Purvam Modi, Ellie Yieh |
2025-05-27 |
|
| 12305279 |
Ultra high-k hafnium oxide and hafnium zirconium oxide films |
Harshil Kashyap, Andrew C. Kummel, Ajay Kumar Yadav, Keith Tatseun Wong, Ellie Yieh |
2025-05-20 |
|
| 12288717 |
Metal based hydrogen barrier |
Srinivas Gandikota, Steven C. H. Hung, Yixiong Yang, Susmit Singha Roy, Nikolaos Bekiaris |
2025-04-29 |
|
| 12288672 |
Methods and apparatus for carbon compound film deposition |
Qiwei Liang, Chentsau Chris Ying, Ellie Yieh, Erica Chen, Nithin Thomas ALEX |
2025-04-29 |
|
| 12204246 |
Metal oxide resist patterning with electrical field guided post-exposure bake |
Huixiong Dai, Mangesh Ashok BANGAR, Steven Hiloong WELCH, Ellie Yieh, Dmitry Lubomirsky |
2025-01-21 |
|
| 12198951 |
High pressure wafer processing systems and related methods |
Qiwei Liang, Adib Khan, Venkata Ravishankar Kasibhotla, Sultan Malik, Sean S. Kang +1 more |
2025-01-14 |
|
| 12142467 |
Self-assembled monolayer deposition from low vapor pressure organic molecules |
Qiwei Liang, Keith Tatseun Wong, Antony K. Jan |
2024-11-12 |
$39,712,000 |
| 12085858 |
Photoresist patterning process |
Huixiong Dai, Steven Hiloong WELCH, Mangesh Ashok BANGAR, Ellie Yieh |
2024-09-10 |
$81,152,000 |
| 12057329 |
Selective etch using material modification and RF pulsing |
Bhargav S. Citla, Chentsau Ying, Viachslav Babayan, Michael W. Stowell |
2024-08-06 |
$90,312,000 |
| 12054827 |
Flowable film curing using H2 plasma |
Shishi Jiang, Pramit Manna, Abhijit Basu Mallick, Suresh Chand Seth |
2024-08-06 |
$90,312,000 |
| 12020982 |
Metal based hydrogen barrier |
Srinivas Gandikota, Steven C. H. Hung, Yixiong Yang, Susmit Singha Roy, Nikolaos Bekiaris |
2024-06-25 |
$57,214,000 |
| 11993842 |
Selective deposition of metal oxide by pulsed chemical vapor deposition |
Keith Tatseun Wong, Andrew C. Kummel, James P. Huang, Yunil Cho |
2024-05-28 |
$67,076,000 |
| 11993845 |
High selectivity atomic layer deposition process |
Jong Hun Choi, Christopher Ahles, Andrew C. Kummel, Keith Tatseun Wong |
2024-05-28 |
$67,076,000 |
| 11972943 |
Methods and apparatus for depositing dielectric material |
Bhargav S. Citla, Jethro Tannos, Joshua Rubnitz |
2024-04-30 |
$79,776,000 |
| 11955333 |
Methods and apparatus for processing a substrate |
Jethro Tannos, Bhargav S. Citla, Ellie Yieh, Joshua Rubnitz, Erica Chen +3 more |
2024-04-09 |
$47,694,000 |
| 11948828 |
Pin-less substrate transfer apparatus and method for a processing chamber |
Sultan Malik, Adib Khan, Qiwei Liang |
2024-04-02 |
$42,223,000 |
| 11934103 |
Apparatus for post exposure bake of photoresist |
Douglas A. Buchberger, Jr., Dmitry Lubomirsky, John O. Dukovic |
2024-03-19 |
$54,086,000 |
| 11914299 |
Lithography process window enhancement for photoresist patterning |
Huixiong Dai, Mangesh Ashok BANGAR, Christopher S. Ngai, Ellie Yieh |
2024-02-27 |
$57,915,000 |
| 11901222 |
Multi-step process for flowable gap-fill film |
Maximillian Clemons, Nikolaos Bekiaris |
2024-02-13 |
$47,589,000 |
| 11899366 |
Method and apparatus for post exposure processing of photoresist wafers |
Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Ludovic Godet, Daniel J. Woodruff +2 more |
2024-02-13 |
$47,589,000 |
| 11881411 |
High pressure annealing process for metal containing materials |
Kaushal K. Singh, Mei-Yee Shek, Ellie Yieh |
2024-01-23 |
$48,508,000 |
| 11880137 |
Film structure for electric field guided photoresist patterning process |
Huixiong Dai, Mangesh Ashok BANGAR, Ellie Yieh, Steven Hiloong WELCH, Christopher S. Ngai |
2024-01-23 |
$48,508,000 |
