Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288717 | Metal based hydrogen barrier | Srinivas Gandikota, Steven C. H. Hung, Srinivas D. Nemani, Yixiong Yang, Susmit Singha Roy | 2025-04-29 |
| 12046508 | Method of dielectric material fill and treatment | Shi YOU, He Ren, Naomi Yoshida, Mehul Naik, Martin Jay Seamons +2 more | 2024-07-23 |
| 12020982 | Metal based hydrogen barrier | Srinivas Gandikota, Steven C. H. Hung, Srinivas D. Nemani, Yixiong Yang, Susmit Singha Roy | 2024-06-25 |
| 11955333 | Methods and apparatus for processing a substrate | Jethro Tannos, Bhargav S. Citla, Srinivas D. Nemani, Ellie Yieh, Joshua Rubnitz +3 more | 2024-04-09 |
| 11901222 | Multi-step process for flowable gap-fill film | Maximillian Clemons, Srinivas D. Nemani | 2024-02-13 |
| 11615984 | Method of dielectric material fill and treatment | Shi YOU, He Ren, Naomi Yoshida, Mehul Naik, Martin Jay Seamons +2 more | 2023-03-28 |
| 11101174 | Gap fill deposition process | Hao Jiang, Erica Chen, Mehul Naik | 2021-08-24 |
| 11043415 | Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping | Zhiyuan Wu, Mehul Naik, Jin-Hee Park, Mark Lee | 2021-06-22 |
| 10438849 | Microwave anneal to improve CVD metal gap-fill and throughput | He Ren, Jie Zhou, Guannan Chen, Michael W. Stowell, Bencherki Mebarki +3 more | 2019-10-08 |
| 10410918 | Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping | Zhiyuan Wu, Mehul Naik, Jin-Hee Park, Mark Lee | 2019-09-10 |
| 9711397 | Cobalt resistance recovery by hydrogen anneal | Mehul Naik, Zhiyuan Wu | 2017-07-18 |
| 9570345 | Cobalt resistance recovery by hydrogen anneal | Mehul Naik, Zhiyuan Wu | 2017-02-14 |
| 8992792 | Method of fabricating an ultra low-k dielectric self-aligned via | Chih-Yang Chang, Sean S. Kang, Chia-Ling Kao | 2015-03-31 |
| 7534627 | Methods and systems for controlling critical dimensions in track lithography tools | Tim Michaelson | 2009-05-19 |
| 7265062 | Ionic additives for extreme low dielectric constant chemical formulations | Robert P. Mandal, Alexandros T. Demos, Timothy Weidman, Michael P. Nault, Scott J. Weigel +3 more | 2007-09-04 |
| 7244683 | Integration of ALD/CVD barriers with porous low k materials | Hua Chung, Christophe Marcadal, Ling Chen | 2007-07-17 |
| 7226853 | Method of forming a dual damascene structure utilizing a three layer hard mask structure | Timothy Weidman, Michael D. Armacost, Mehul Naik | 2007-06-05 |
| 6991739 | Method of photoresist removal in the presence of a dielectric layer having a low k-value | Mark Kawaguchi, Huong Nguyen, James S. Papanu | 2006-01-31 |
| 6896955 | Ionic additives for extreme low dielectric constant chemical formulations | Robert P. Mandal, Alexandros T. Demos, Timothy Weidman, Michael P. Nault, Scott J. Weigel +3 more | 2005-05-24 |
| 6818289 | Mesoporous films having reduced dielectric constants | James Edward MacDougall, Kevin Ray Heier, Scott J. Weigel, Timothy Weidman, Alexandros T. Demos +3 more | 2004-11-16 |
| 6806203 | Method of forming a dual damascene structure using an amorphous silicon hard mask | Timothy Weidman, Josephine B. Chang, Phong H. Nguyen | 2004-10-19 |
| 6592980 | Mesoporous films having reduced dielectric constants | James Edward MacDougall, Kevin Ray Heier, Scott J. Weigel, Timothy Weidman, Alexandros T. Demos +3 more | 2003-07-15 |
| 6576568 | Ionic additives for extreme low dielectric constant chemical formulations | Robert P. Mandal, Alexandros T. Demos, Timothy Weidman, Michael P. Nault, Scott J. Weigel +3 more | 2003-06-10 |