Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334318 | Plasma preclean system for cluster tool | Songjae Lee, Masato Ishii, Martin TRUEMPER, Richard O. Collins, Martin Jeffrey Salinas +5 more | 2025-06-17 |
| 9032906 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Kavita Shah, Dien-Yeh Wu, Seshadri Ganguli, Frederick Wu +1 more | 2015-05-19 |
| 8951478 | Ampoule with a thermally conductive coating | Schubert S. Chu, Seshadri Ganguli, Norman Nakashima, Dien-Yeh Wu | 2015-02-10 |
| 8216374 | Gas coupler for substrate processing chamber | Joel M. Huston, Jeffery Tobin | 2012-07-10 |
| 8062422 | Method and apparatus for generating a precursor for a semiconductor processing system | Ling Chen, Vincent Ku, Hua Chung, Seshadri Ganguli, Jenny Lin +3 more | 2011-11-22 |
| 7850779 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Kavita Shah, Dien-Yeh Wu, Seshadri Ganguli, Frederick Wu +1 more | 2010-12-14 |
| 7838441 | Deposition and densification process for titanium nitride barrier layers | Amit Khandelwal, Avgerinos V. Gelatos, Mei Chang | 2010-11-23 |
| 7832432 | Chemical delivery apparatus for CVD or ALD | Norman Nakashima, Seshadri Ganguli, Paul F. Ma, Schubert S. Chu | 2010-11-16 |
| 7833358 | Method of recovering valuable material from exhaust gas stream of a reaction chamber | Schubert S. Chu, Frederick Wu, Seshadri Ganguli, Dien-Yeh Wu, Kavita Shah +1 more | 2010-11-16 |
| 7748400 | Chemical delivery apparatus for CVD or ALD | Norman Nakashima, Seshadri Ganguli, Paul F. Ma, Schubert S. Chu | 2010-07-06 |
| 7691742 | Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA | Rongjun Wang, Hua Chung, Nirmalya Maity | 2010-04-06 |
| 7682946 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Kavita Shah, Dien-Yeh Wu, Seshadri Ganguli, Frederick Wu +1 more | 2010-03-23 |
| 7597758 | Chemical precursor ampoule for vapor deposition processes | Ling Chen, Vincent Ku, Hua Chung, Seshadri Ganguli, Jenny Lin +3 more | 2009-10-06 |
| 7588736 | Apparatus and method for generating a chemical precursor | Ling Chen, Vincent Ku, Hua Chung, Seshadri Ganguli, Jenny Lin +3 more | 2009-09-15 |
| 7576002 | Multi-step barrier deposition method | Ling Chen, Seshadri Ganguli, Wei Cao | 2009-08-18 |
| 7568495 | Chemical delivery apparatus for CVD or ALD | Norman Nakashima, Seshadri Ganguli, Paul F. Ma, Schubert S. Chu | 2009-08-04 |
| 7562672 | Chemical delivery apparatus for CVD or ALD | Norman Nakashima, Seshadri Ganguli, Paul F. Ma, Schubert S. Chu | 2009-07-21 |
| 7524762 | Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA | Rongjun Wang, Hua Chung, Nirmalya Maity | 2009-04-28 |
| 7524374 | Method and apparatus for generating a precursor for a semiconductor processing system | Ling Chen, Vincent Ku, Hua Chung, Seshadri Ganguli, Jenny Lin +3 more | 2009-04-28 |
| 7521379 | Deposition and densification process for titanium nitride barrier layers | Amit Khandelwal, Avgerinos V. Gelatos, Mei Chang | 2009-04-21 |
| 7270709 | Method and apparatus of generating PDMAT precursor | Ling Chen, Vincent Ku, Hua Chung, Seshadri Ganguli, Jenny Lin +3 more | 2007-09-18 |
| 7265048 | Reduction of copper dewetting by transition metal deposition | Hua Chung, Seshadri Ganguli, Jick Yu | 2007-09-04 |
| 7244683 | Integration of ALD/CVD barriers with porous low k materials | Hua Chung, Nikolaos Bekiaris, Ling Chen | 2007-07-17 |
| 7241686 | Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA | Rongjun Wang, Hua Chung, Nirmalya Maity | 2007-07-10 |
| 7026238 | Reliability barrier integration for Cu application | Ming Xi, Paul Smith, Ling Chen, Michael Yang, Mei Chang +2 more | 2006-04-11 |