Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9012334 | Formation of a tantalum-nitride layer | Sean M. Seutter, Ming Xi | 2015-04-21 |
| 8123881 | Die-to-robot alignment for die-to-substrate bonding | Damon K. Cox, Todd Egan, Jeffrey C. Hudgens | 2012-02-28 |
| 8114789 | Formation of a tantalum-nitride layer | Sean M. Seutter, Ming Xi | 2012-02-14 |
| 7867914 | System and method for forming an integrated barrier layer | Ming Xi, Hui Zhang | 2011-01-11 |
| 7820026 | Method to deposit organic grafted film on barrier layer | Hooman Hafezi, Aron Rosenfeld | 2010-10-26 |
| 7779784 | Apparatus and method for plasma assisted deposition | Chen-An Chen, Avgerinos V. Gelatos, Ming Xi, Mark Hytros | 2010-08-24 |
| 7781326 | Formation of a tantalum-nitride layer | Sean M. Seutter, Ming Xi | 2010-08-24 |
| 7745333 | Methods for depositing tungsten layers employing atomic layer deposition techniques | Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more | 2010-06-29 |
| 7732325 | Plasma-enhanced cyclic layer deposition process for barrier layers | Toshio Itoh, Ming Xi | 2010-06-08 |
| 7670465 | Anolyte for copper plating | Nicolay Kovarsky | 2010-03-02 |
| 7605083 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2009-10-20 |
| 7514353 | Contact metallization scheme using a barrier layer over a silicide layer | Timothy Weidman, Kapila Wijekoon, Zhize Zhu, Avgerinos V. Gelatos, Amit Khandelwal +3 more | 2009-04-07 |
| 7504335 | Grafted seed layer for electrochemical plating | Aron Rosenfeld, Hooman Hafezi, Zhi-Wen Sun, John O. Dukovic | 2009-03-17 |
| 7473339 | Slim cell platform plumbing | Allen L. D'Ambra, Arulkumar Shanmugasundram, Yevgeniy Rabinovich, Dmitry Lubomirsky | 2009-01-06 |
| 7473638 | Plasma-enhanced cyclic layer deposition process for barrier layers | Toshio Itoh, Ming Xi | 2009-01-06 |
| 7405158 | Methods for depositing tungsten layers employing atomic layer deposition techniques | Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more | 2008-07-29 |
| 7396565 | Multiple precursor cyclical deposition system | Hyungsuk Alexander Yoon, Hui Zhang, Hongbin Fang, Ming Xi | 2008-07-08 |
| 7384867 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2008-06-10 |
| 7279432 | System and method for forming an integrated barrier layer | Ming Xi, Hui Zhang | 2007-10-09 |
| 7247222 | Electrochemical processing cell | Dmitry Lubomirsky, Yezdi Dordi, Saravjeet Singh, Sheshraj Tulshibagwale, Nicolay Kovarsky | 2007-07-24 |
| 7223323 | Multi-chemistry plating system | Ming Xi, Russell C. Ellwanger, Eric Bramwell Britcher, Bernardo Donoso, Lily Pang +11 more | 2007-05-29 |
| 7201803 | Valve control system for atomic layer deposition chamber | Siqing Lu, Yu-Chia Chang, Dongxi Sun, Vinh Dang, Anzhong Chang +2 more | 2007-04-10 |
| 7128823 | Anolyte for copper plating | Nicolay Kovarsky | 2006-10-31 |
| 7094685 | Integration of titanium and titanium nitride layers | Toshio Itoh, Ming Xi | 2006-08-22 |
| 7094680 | Formation of a tantalum-nitride layer | Sean M. Seutter, Ming Xi | 2006-08-22 |