| 9012334 |
Formation of a tantalum-nitride layer |
Sean M. Seutter, Ming Xi |
2015-04-21 |
$14,570,000 |
| 8123881 |
Die-to-robot alignment for die-to-substrate bonding |
Damon K. Cox, Todd Egan, Jeffrey C. Hudgens |
2012-02-28 |
$8,688,000 |
| 8114789 |
Formation of a tantalum-nitride layer |
Sean M. Seutter, Ming Xi |
2012-02-14 |
$12,695,000 |
| 7867914 |
System and method for forming an integrated barrier layer |
Ming Xi, Hui Zhang |
2011-01-11 |
$9,486,000 |
| 7820026 |
Method to deposit organic grafted film on barrier layer |
Hooman Hafezi, Aron Rosenfeld |
2010-10-26 |
$13,462,000 |
| 7779784 |
Apparatus and method for plasma assisted deposition |
Chen-An Chen, Avgerinos V. Gelatos, Ming Xi, Mark Hytros |
2010-08-24 |
$4,612,000 |
| 7781326 |
Formation of a tantalum-nitride layer |
Sean M. Seutter, Ming Xi |
2010-08-24 |
$4,612,000 |
| 7745333 |
Methods for depositing tungsten layers employing atomic layer deposition techniques |
Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more |
2010-06-29 |
$7,165,000 |
| 7732325 |
Plasma-enhanced cyclic layer deposition process for barrier layers |
Toshio Itoh, Ming Xi |
2010-06-08 |
$8,435,000 |
| 7670465 |
Anolyte for copper plating |
Nicolay Kovarsky |
2010-03-02 |
$15,045,000 |
| 7605083 |
Formation of composite tungsten films |
Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more |
2009-10-20 |
$54,871,000 |
| 7514353 |
Contact metallization scheme using a barrier layer over a silicide layer |
Timothy Weidman, Kapila Wijekoon, Zhize Zhu, Avgerinos V. Gelatos, Amit Khandelwal +3 more |
2009-04-07 |
$14,489,000 |
| 7504335 |
Grafted seed layer for electrochemical plating |
Aron Rosenfeld, Hooman Hafezi, Zhi-Wen Sun, John O. Dukovic |
2009-03-17 |
$10,205,000 |
| 7473339 |
Slim cell platform plumbing |
Allen L. D'Ambra, Arulkumar Shanmugasundram, Yevgeniy Rabinovich, Dmitry Lubomirsky |
2009-01-06 |
$22,624,000 |
| 7473638 |
Plasma-enhanced cyclic layer deposition process for barrier layers |
Toshio Itoh, Ming Xi |
2009-01-06 |
$22,624,000 |
| 7405158 |
Methods for depositing tungsten layers employing atomic layer deposition techniques |
Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more |
2008-07-29 |
$53,476,000 |
| 7396565 |
Multiple precursor cyclical deposition system |
Hyungsuk Alexander Yoon, Hui Zhang, Hongbin Fang, Ming Xi |
2008-07-08 |
$41,700,000 |
| 7384867 |
Formation of composite tungsten films |
Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more |
2008-06-10 |
$47,143,000 |
| 7279432 |
System and method for forming an integrated barrier layer |
Ming Xi, Hui Zhang |
2007-10-09 |
$22,463,000 |
| 7247222 |
Electrochemical processing cell |
Dmitry Lubomirsky, Yezdi Dordi, Saravjeet Singh, Sheshraj Tulshibagwale, Nicolay Kovarsky |
2007-07-24 |
$43,233,000 |
| 7223323 |
Multi-chemistry plating system |
Ming Xi, Russell C. Ellwanger, Eric Bramwell Britcher, Bernardo Donoso, Lily Pang +11 more |
2007-05-29 |
$18,482,000 |
| 7201803 |
Valve control system for atomic layer deposition chamber |
Siqing Lu, Yu-Chia Chang, Dongxi Sun, Vinh Dang, Anzhong Chang +2 more |
2007-04-10 |
$37,340,000 |
| 7128823 |
Anolyte for copper plating |
Nicolay Kovarsky |
2006-10-31 |
$22,898,000 |
| 7094685 |
Integration of titanium and titanium nitride layers |
Toshio Itoh, Ming Xi |
2006-08-22 |
$13,029,000 |
| 7094680 |
Formation of a tantalum-nitride layer |
Sean M. Seutter, Ming Xi |
2006-08-22 |
$13,029,000 |
