Issued Patents All Time
Showing 1–25 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984354 | Zincating and doping of metal liner for liner passivation and adhesion improvement | Aniruddha Joi, Dries Dictus | 2024-05-14 |
| 11424158 | Metal liner passivation and adhesion enhancement by zinc doping | Aniruddha Joi, Steven James Madsen, Dries Dictus | 2022-08-23 |
| 11225714 | Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment | Kailash Venkatraman, Aniruddha Joi | 2022-01-18 |
| 10741440 | Metal liner passivation and adhesion enhancement by zinc doping | Aniruddha Joi, Steven James Madsen, Dries Dictus | 2020-08-11 |
| 10640874 | Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias | Aniruddha Joi, Kailash Venkatraman | 2020-05-05 |
| 10508351 | Layer-by-layer deposition using hydrogen | Aniruddha Joi | 2019-12-17 |
| 10501846 | Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment | Kailash Venkatraman, Aniruddha Joi | 2019-12-10 |
| 10483163 | Self-forming barrier process | Aniruddha Joi | 2019-11-19 |
| 10262943 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more | 2019-04-16 |
| 10163695 | Self-forming barrier process | Aniruddha Joi | 2018-12-25 |
| 9875968 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more | 2018-01-23 |
| 9583386 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more | 2017-02-28 |
| 9499913 | Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent | Eugenijus Norkus, Ina Stankeviciene, Aldona Jagminiene, Loreta Tamasauskaite-Tamasiunaite, Aniruddha Joi | 2016-11-22 |
| 9476124 | Selective deposition and co-deposition processes for ferromagnetic thin films | Aniruddha Joi, Ernest C. Chen | 2016-10-25 |
| 9469902 | Electroless deposition of continuous platinum layer | Eugenijus Norkus, Aldona Jagminiene, Albina Zieliene, Ina Stankeviciene, Loreta Tamasauskaite-Tamasiunaite +1 more | 2016-10-18 |
| 9428836 | Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents | Eugenijus Norkus, Ina Stankeviciene, Aldona Jagminiene, Aniruddha Joi, Loreta Tamasauskaite-Tamasiunaite +1 more | 2016-08-30 |
| 9359673 | Apparatus and method for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, John M. Boyd | 2016-06-07 |
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, John Parks, Tiruchirapalli Arunagiri +5 more | 2016-03-15 |
| 9117860 | Controlled ambient system for interface engineering | John M. Boyd, Tiruchirapalli Arunagiri, Benjamin W. Mooring, John Parks, William Thie +7 more | 2015-08-25 |
| 9076844 | Process integration scheme to lower overall dielectric constant in BEoL interconnect structures | Nicolas Bright, David Hemker, Fritz Redeker | 2015-07-07 |
| 8916232 | Method for barrier interface preparation of copper interconnect | Hyungsuk Alexander Yoon, John M. Boyd, Fritz Redeker | 2014-12-23 |
| 8883027 | Methods for removing a metal oxide from a substrate | Hyungsuk Alexander Yoon, William Thie, Andrew D. Bailey, III | 2014-11-11 |
| 8844461 | Fluid handling system for wafer electroless plating and associated methods | William Thie, John M. Boyd, Fritz Redeker, John Parks, Tiruchirapalli Arunagiri +5 more | 2014-09-30 |
| 8822344 | Method of etching an etch layer | — | 2014-09-02 |
| 8771804 | Processes and systems for engineering a copper surface for selective metal deposition | John M. Boyd, Tiruchirapalli Arunagiri, Fritz Redeker, William Thie, Arthur M. Howald | 2014-07-08 |