Issued Patents All Time
Showing 26–50 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8747960 | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide | John M. Boyd, Tiruchirapalli Arunagiri, Johan VERTOMMEN, Fritz Redeker, William Thie +1 more | 2014-06-10 |
| 8673769 | Methods and apparatuses for three dimensional integrated circuits | John M. Boyd, Fritz Redeker, Hyungsuk Alexander Yoon, Shijian Li | 2014-03-18 |
| 8622020 | Simultaneous electroless plating of two substrates | William Thie, John M. Boyd, Fritz Redeker | 2014-01-07 |
| 8623456 | Methods for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, John M. Boyd | 2014-01-07 |
| 8524329 | Electroless copper deposition | Richard Janek, Dries Dictus | 2013-09-03 |
| 8519461 | Device with post-contact back end of line through-hole via integration | John M. Boyd, Fritz Redeker, Hyungsuk Alexander Yoon, Shijian Li | 2013-08-27 |
| 8490573 | Method and apparatus for material deposition | John M. Boyd, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook | 2013-07-23 |
| 8485120 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, John Parks, Tiruchirapalli Arunagiri +5 more | 2013-07-16 |
| 8419917 | Electroplating head and method for operating the same | Bob Maraschin, John M. Boyd, Fred C. Redeker | 2013-04-16 |
| 8403727 | Pre-planarization system and method | Fred C. Redeker, John M. Boyd, Sabir A. Majumder, Simon McClatchie | 2013-03-26 |
| 8323460 | Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal | John M. Boyd, Fritz Redeker, Hyungsuk Alexander Yoon, Shijian Li | 2012-12-04 |
| 8314027 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, John Parks, Tiruchirapalli Arunagiri +5 more | 2012-11-20 |
| 8298325 | Electroless deposition from non-aqueous solutions | Eugenijus Norkus, Jane Jaciauskiene | 2012-10-30 |
| 8287647 | Apparatus and method for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, John M. Boyd | 2012-10-16 |
| 8241701 | Processes and systems for engineering a barrier surface for copper deposition | John M. Boyd, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon, Fritz Redeker, William Thie +1 more | 2012-08-14 |
| 8221608 | Proximity processing using controlled batch volume with an integrated proximity head | Carl Woods, Jacob Wylie, Robert A. Maraschin | 2012-07-17 |
| 8187968 | Methods of post-contact back end of line through-hole via integration | John M. Boyd, Fritz Redeker, Hyungsuk Alexander Yoon, Shijian Li | 2012-05-29 |
| 8133812 | Methods and systems for barrier layer surface passivation | John M. Boyd, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Alex Yoon | 2012-03-13 |
| 8084356 | Methods of low-K dielectric and metal process integration | Arthur M. Howald | 2011-12-27 |
| 8069813 | Wafer electroless plating system and associated methods | William Thie, John M. Boyd, Fritz Redeker, John Parks, Tiruchirapalli Arunagiri +5 more | 2011-12-06 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, John M. Boyd, Hyungsuk Alexander Yoon, Shijian Li | 2011-11-08 |
| 8048283 | Method and apparatus for plating semiconductor wafers | Bob Maraschin, John M. Boyd, Fred C. Redeker, Carl Woods | 2011-11-01 |
| 8034409 | Methods, apparatuses, and systems for fabricating three dimensional integrated circuits | Shijian Li, Fritz Redeker | 2011-10-11 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | John M. Boyd, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon | 2011-09-27 |
| 7947157 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers | Mike Ravkin, John M. Boyd, Fred C. Redeker, John M. de Larios | 2011-05-24 |