Issued Patents All Time
Showing 25 most recent of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10264013 | Preventing a memory attack to a wireless access point | Yongqiang Liu, Jun Xie, Xunteng Xu | 2019-04-16 |
| 10147587 | Waferless clean in dielectric etch process | David Carman, Chander Radhakrishnan | 2018-12-04 |
| 9824865 | Waferless clean in dielectric etch process | David Carman, Chander Radhakrishnan | 2017-11-21 |
| 9752231 | Apparatus for electroless metal deposition having filter system and associated oxygen source | — | 2017-09-05 |
| 9628993 | Determining a legitimate access point response | Yongqiang Liu, Jun Xie | 2017-04-18 |
| 8790465 | Post-deposition cleaning methods for substrates with cap layers | Artur Kolics, Tiruchirapalli Arunagiri, William Thie | 2014-07-29 |
| 8673769 | Methods and apparatuses for three dimensional integrated circuits | John M. Boyd, Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon | 2014-03-18 |
| 8551575 | Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process | Artur Kolics, Tiruchirapalli Arunagiri | 2013-10-08 |
| 8519461 | Device with post-contact back end of line through-hole via integration | John M. Boyd, Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon | 2013-08-27 |
| 8404626 | Post-deposition cleaning methods and formulations for substrates with cap layers | Artur Kolics, Tiruchirapalli Arunagiri, William Thie | 2013-03-26 |
| 8323460 | Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal | John M. Boyd, Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon | 2012-12-04 |
| 8187968 | Methods of post-contact back end of line through-hole via integration | John M. Boyd, Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon | 2012-05-29 |
| 8168519 | Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces | Kartik Ramaswamy, Hiroji Hanawa, Seon-Mee Cho, Biagio Gallo, Dongwon Choi +1 more | 2012-05-01 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, John M. Boyd, Yezdi Dordi, Hyungsuk Alexander Yoon | 2011-11-08 |
| 8034409 | Methods, apparatuses, and systems for fabricating three dimensional integrated circuits | Fritz Redeker, Yezdi Dordi | 2011-10-11 |
| 7980255 | Single wafer dryer and drying methods | Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman +4 more | 2011-07-19 |
| 7977199 | Method for measuring dopant concentration during plasma ion implantation | Majeed A. Foad | 2011-07-12 |
| 7968439 | Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces | Kartik Ramaswamy, Hiroji Hanawa, Seon-Mee Cho, Biagio Gallo, Dongwon Choi +1 more | 2011-06-28 |
| 7749893 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, John M. Boyd, Yezdi Dordi, Hyungsuk Alexander Yoon | 2010-07-06 |
| 7732309 | Plasma immersed ion implantation process | Kartik Ramaswamy, Biagio Gallo, Dong-Hyung LEE, Majeed A. Foad | 2010-06-08 |
| 7713757 | Method for measuring dopant concentration during plasma ion implantation | Majeed A. Foad | 2010-05-11 |
| 7691755 | Plasma immersion ion implantation with highly uniform chamber seasoning process for a toroidal source reactor | Lily Pang, Majeed A. Foad, Seon-Mee Cho | 2010-04-06 |
| 7615480 | Methods of post-contact back end of the line through-hole via integration | John M. Boyd, Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon | 2009-11-10 |
| 7513062 | Single wafer dryer and drying methods | Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman +4 more | 2009-04-07 |
| 7497767 | Vibration damping during chemical mechanical polishing | Hung Chih Chen, John M. White, Ramin Emami, Fred C. Redeker, Steven M. Zuniga +1 more | 2009-03-03 |