Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11209729 | Vacuum-integrated hardmask processes and apparatus | Jeffrey Marks, George Andrew Antonelli, Richard A. Gottscho, Dennis M. Hausmann, Adrien LaVoie +3 more | 2021-12-28 |
| 10831096 | Vacuum-integrated hardmask processes and apparatus | Jeffrey Marks, George Andrew Antonelli, Richard A. Gottscho, Dennis M. Hausmann, Adrien LaVoie +3 more | 2020-11-10 |
| 10514598 | Vacuum-integrated hardmask processes and apparatus | Jeffrey Marks, George Andrew Antonelli, Richard A. Gottscho, Dennis M. Hausmann, Adrien LaVoie +3 more | 2019-12-24 |
| 10262943 | Interlevel conductor pre-fill utilizing selective barrier deposition | William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more | 2019-04-16 |
| 10103056 | Methods for wet metal seed deposition for bottom up gapfill of features | Samantha Tan, Boris Volosskiy, Taeseung Kim, Praveen Nalla, Novy Tjokro | 2018-10-16 |
| 10079207 | Metallization of the wafer edge for optimized electroplating performance on resistive substrates | — | 2018-09-18 |
| 10049921 | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor | Nerissa Draeger, Kaihan Ashtiani, Deenesh Padhi, Derek Wong, Bart J. van Schravendijk +3 more | 2018-08-14 |
| 9875968 | Interlevel conductor pre-fill utilizing selective barrier deposition | William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more | 2018-01-23 |
| 9837312 | Atomic layer etching for enhanced bottom-up feature fill | Samantha Tan, Taeseung Kim, Jengyi Yu, Praveen Nalla, Novy Tjokro +1 more | 2017-12-05 |
| 9818617 | Method of electroless plating using a solution with at least two borane containing reducing agents | Praveen Nalla, Xiaomin Bin, Nanhai Li, Yaxin Wang, Patrick William Little +1 more | 2017-11-14 |
| 9778561 | Vacuum-integrated hardmask processes and apparatus | Jeffrey Marks, George Andrew Antonelli, Richard A. Gottscho, Dennis M. Hausmann, Adrien LaVoie +3 more | 2017-10-03 |
| 9768063 | Dual damascene fill | Praveen Nalla, Lie Zhao | 2017-09-19 |
| 9761524 | Metallization of the wafer edge for optimized electroplating performance on resistive substrates | — | 2017-09-12 |
| 9691622 | Pre-fill wafer cleaning formulation | — | 2017-06-27 |
| 9583386 | Interlevel conductor pre-fill utilizing selective barrier deposition | William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more | 2017-02-28 |
| 9551074 | Electroless plating solution with at least two borane containing reducing agents | Praveen Nalla, Xiaomin Bin, Nanhai Li, Yaxin Wang, Patrick William Little +1 more | 2017-01-24 |
| 9490211 | Copper interconnect | Lie Zhao | 2016-11-08 |
| 9476018 | Wafer cleaning formulation | — | 2016-10-25 |
| 9406556 | Method of making an interconnect device | — | 2016-08-02 |
| 9382627 | Methods and materials for anchoring gapfill metals | — | 2016-07-05 |
| 9368340 | Metallization of the wafer edge for optimized electroplating performance on resistive substrates | — | 2016-06-14 |
| 9353444 | Two-step deposition with improved selectivity | Praveen Nalla, Seshasayee Varadarajan | 2016-05-31 |
| 9287183 | Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch | Larry Zhao, Praveen Nalla | 2016-03-15 |
| 9153449 | Electroless gap fill | — | 2015-10-06 |
| 9142416 | Process to reduce nodule formation in electroless plating | Nanhai Li, Xiaomin Bin, Yaxin Wang, Marina Polyanskaya, Novy Tjokro | 2015-09-22 |