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Interlevel conductor pre-fill utilizing selective barrier deposition |
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2019-04-16 |
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Integrated direct dielectric and metal deposition |
Bart J. van Schravendijk, David Charles Smith, Michal Danek, Patrick A. Van Cleemput, Ramesh Chandrasekharan |
2018-11-13 |
| 9875968 |
Interlevel conductor pre-fill utilizing selective barrier deposition |
Artur Kolics, Larry Zhao, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more |
2018-01-23 |
| 9583386 |
Interlevel conductor pre-fill utilizing selective barrier deposition |
Artur Kolics, Larry Zhao, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more |
2017-02-28 |
| 9418889 |
Selective formation of dielectric barriers for metal interconnects in semiconductor devices |
Thomas W. Mountsier, Hui-Jung Wu, Bhadri N. Varadarajan, Nagraj Shankar |
2016-08-16 |
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Inflator |
— |
2016-06-14 |
| 9184060 |
Plated metal hard mask for vertical NAND hole etch |
— |
2015-11-10 |
| 9006893 |
Devices for metallization |
Artur Kolics, Fritz Redeker |
2015-04-14 |
| 8828863 |
Electroless copper deposition with suppressor |
Xiaomin Bin |
2014-09-09 |
| 8673779 |
Interconnect with self-formed barrier |
Hyungsuk Alexander Yoon |
2014-03-18 |
| 8518815 |
Methods, devices, and materials for metallization |
Artur Kolics, Fritz Redeker |
2013-08-27 |
| 6557967 |
Method for making ink-jet printer nozzles |
— |
2003-05-06 |
| 6235634 |
Modular substrate processing system |
John M. White, Robert B. Conner, Jr., Kam S. Law, Norman L. Turner, Shinichi Kurita |
2001-05-22 |
| 6171510 |
Method for making ink-jet printer nozzles |
— |
2001-01-09 |
| 5675499 |
Optimal probe point placement |
Ronny Soetarman, Christopher G. Talbot |
1997-10-07 |
| 5530372 |
Method of probing a net of an IC at an optimal probe-point |
Ronny Soetarman, Christopher G. Talbot |
1996-06-25 |
| D363429 |
Cover for containerized printer's ink |
— |
1995-10-24 |
| 4830092 |
Heat enhancers and salt purifiers for thermal energy storage canister |
— |
1989-05-16 |
