Issued Patents All Time
Showing 25 most recent of 125 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417943 | Reducing intralevel capacitance in semiconductor devices | Joseph R. Abel, Ian John Curtin, Douglas Walter Agnew, Dustin Zachary Austin, Awnish Gupta | 2025-09-16 |
| 12412742 | Impurity reduction in silicon-containing films | Awnish Gupta, Jason Alexander Varnell, Joseph R. Abel, Jennifer Leigh Petraglia, Adrien LaVoie | 2025-09-09 |
| 12385138 | Plasma-enhanced deposition of film stacks | Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Dong Niu, Keith Fox +5 more | 2025-08-12 |
| 12341002 | Low stress films for advanced semiconductor applications | Reza Bayati, Jonathan Church, Keith Fox | 2025-06-24 |
| 12261038 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Hu Kang, Shankar Swaminathan, Jun Qian, Wanki Kim, Dennis M. Hausmann +1 more | 2025-03-25 |
| 12248252 | Bubble defect reduction | Akhil Singhal, Girish Dixit, David Charles Smith, Siva Kanakasabapathy | 2025-03-11 |
| 12125705 | Method for providing doped silicon using a diffusion barrier layer | Purushottam Kumar, Gengwei Jiang, Tengfei Miao, Joseph R. Abel, Adrien LaVoie | 2024-10-22 |
| 12112980 | Method to create air gaps | Patrick A. Van Cleemput, Seshasayee Varadarajan | 2024-10-08 |
| 12087574 | Oxidative conversion in atomic layer deposition processes | Douglas Walter Agnew, Joseph R. Abel | 2024-09-10 |
| 12087572 | Etch stop layer | Soumana Hamma, Kai-Lin Ou, Ming Li, Malay Milan Samantaray | 2024-09-10 |
| 12087573 | Modulation of oxidation profile for substrate processing | Gerald Joseph Brady, Kevin McLaughlin, Pratik Sankhe, Shriram Vasant Bapat | 2024-09-10 |
| 12080592 | Film stack simplification for high aspect ratio patterning and vertical scaling | Hui-Jung Wu, Mark Kawaguchi, Gereng Gunawan, Jay E. Uglow, Nagraj Shankar +11 more | 2024-09-03 |
| 12051589 | Tin oxide thin film spacers in semiconductor device manufacturing | David Charles Smith, Richard Wise, Arpan Mahorowala, Patrick A. Van Cleemput | 2024-07-30 |
| 12049699 | Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching | Joseph R. Abel, Purushottam Kumar, Adrien LaVoie | 2024-07-30 |
| 12040181 | Modulated atomic layer deposition | Chan Myae Myae Soe, Chloe Baldasseroni, Shiva Sharan Bhandari, Pulkit Agarwal, Adrien LaVoie | 2024-07-16 |
| 12037686 | Selective carbon deposition | Awnish Gupta, Adrien LaVoie, Samantha Tan | 2024-07-16 |
| 11920239 | Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma | Bhadri N. Varadarajan, Bo Gong, Rachel E. Batzer, Huatan Qiu, Geoffrey Hohn | 2024-03-05 |
| 11784047 | Tin oxide thin film spacers in semiconductor device manufacturing | David Charles Smith, Richard Wise, Arpan Mahorowala, Patrick A. Van Cleemput | 2023-10-10 |
| 11637037 | Method to create air gaps | Patrick A. Van Cleemput, Seshasayee Varadarajan | 2023-04-25 |
| 11293098 | Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching | Joseph R. Abel, Purushottam Kumar, Adrien LaVoie | 2022-04-05 |
| 11183383 | Tin oxide thin film spacers in semiconductor device manufacturing | David Charles Smith, Richard Wise, Arpan Mahorowala, Patrick A. Van Cleemput | 2021-11-23 |
| 11133180 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Hu Kang, Shankar Swaminathan, Jun Qian, Wanki Kim, Dennis M. Hausmann +1 more | 2021-09-28 |
| 11088019 | Method to create air gaps | Patrick A. Van Cleemput, Seshasayee Varadarajan | 2021-08-10 |
| 11053587 | Radical source design for remote plasma atomic layer deposition | — | 2021-07-06 |
| 11049716 | Gap fill using carbon-based films | Wei Tang, Jason D. Park, Shu Tsai Wang, Kaihan Ashtiani | 2021-06-29 |