Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417916 | Tin oxide films in semiconductor device manufacturing | Jengyi Yu, Samantha Tan, Yu Jiang, Richard Wise, Yang Pan +2 more | 2025-09-16 |
| 12183589 | Tin oxide mandrels in patterning | Jengyi Yu, Samantha Tan, Seongjun Heo, Boris Volosskiy, Sivananda K. Kanakasabapathy +2 more | 2024-12-31 |
| 12142868 | Chip-fixing device for a socket | Tsung-I Lin, Shou-Sheng Hsu | 2024-11-12 |
| 12094711 | Tin oxide films in semiconductor device manufacturing | Jengyi Yu, Samantha Tan, Yu Jiang, Richard Wise, Yang Pan +2 more | 2024-09-17 |
| 12080592 | Film stack simplification for high aspect ratio patterning and vertical scaling | Bart J. van Schravendijk, Mark Kawaguchi, Gereng Gunawan, Jay E. Uglow, Nagraj Shankar +11 more | 2024-09-03 |
| 11987876 | Chamfer-less via integration scheme | Sivananda K. Kanakasabapathy, Richard Wise, Arpan Mahorowala | 2024-05-21 |
| 11792987 | Self-aligned vertical integration of three-terminal memory devices | Thorsten Lill, Meihua Shen, John Hoang, Gereng Gunawan, Yang Pan | 2023-10-17 |
| 11630147 | Low-thermal resistance pressing device for a socket | Ming-Cheng Huang, Tsung-I Lin, Chien-Ming Chen | 2023-04-18 |
| 11355353 | Tin oxide mandrels in patterning | Jengyi Yu, Samantha Tan, Seongjun Heo, Boris Volosskiy, Sivananda K. Kanakasabapathy +2 more | 2022-06-07 |
| 11322351 | Tin oxide films in semiconductor device manufacturing | Jengyi Yu, Samantha Tan, Yu Jiang, Richard Wise, Yang Pan +2 more | 2022-05-03 |
| 10546748 | Tin oxide films in semiconductor device manufacturing | Jengyi Yu, Samantha Tan, Yu Jiang, Richard Wise, Yang Pan +2 more | 2020-01-28 |
| 10199235 | Liner and barrier applications for subtractive metal integration | Thomas Knisley, Nagraj Shankar, Meihua Shen, John Hoang, Prithu Sharma | 2019-02-05 |
| 9899234 | Liner and barrier applications for subtractive metal integration | Thomas Knisley, Nagraj Shankar, Meihua Shen, John Hoang, Prithu Sharma | 2018-02-20 |
| 9418889 | Selective formation of dielectric barriers for metal interconnects in semiconductor devices | Thomas W. Mountsier, Bhadri N. Varadarajan, Nagraj Shankar, William T. Lee | 2016-08-16 |
| 8753978 | Metal and silicon containing capping layers for interconnects | Jengyi Yu, Gengwei Jiang, Pramod Subramonium, Roey Shaviv, Nagraj Shankar | 2014-06-17 |
| 8268722 | Interfacial capping layers for interconnects | Jengyi Yu, Girish Dixit, Bart J. van Schravendijk, Pramod Subramonium, Gengwei Jiang +2 more | 2012-09-18 |
| 8173537 | Methods for reducing UV and dielectric diffusion barrier interaction | Kaushik Chattopadhyay, Keith Fox, Tom Mountsier, Bart J. van Schravendijk, Kimberly Branshaw | 2012-05-08 |
| 8124522 | Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties | Kimberly Shafi, Kaushik Chattopadhyay, Keith Fox, Tom Mountsier, Girish Dixit +2 more | 2012-02-28 |
| 8021486 | Protective self-aligned buffer layers for damascene interconnects | Yongsik Yu, Mandyam Sriram, Roey Shaviv, Kaushik Chattopadhyay | 2011-09-20 |
| 8017523 | Deposition of doped copper seed layers having improved reliability | Daniel R. Juliano, Wen Wu, Girish Dixit | 2011-09-13 |
| 7704873 | Protective self-aligned buffer layers for damascene interconnects | Yongsik Yu, Mandyam Sriram, Roey Shaviv, Kaushik Chattopadhyay | 2010-04-27 |
| 7576006 | Protective self-aligned buffer layers for damascene interconnects | Yongsik Yu, Mandyam Sriram, Roey Shaviv, Kaushik Chattopadhyay | 2009-08-18 |
| 6914114 | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography | Teresa Baldwin, Mary Richey, James Drage, Richard Spear | 2005-07-05 |
| 6841256 | Low dielectric constant polyorganosilicon materials generated from polycarbosilanes | Paul Apen | 2005-01-11 |
| 6780517 | Polycarbosilane adhesion promoters for low dielectric constant polymeric materials | Tian-An Chen, Anna George, Kreistler S. Y. Lau | 2004-08-24 |