Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8513111 | Forming semiconductor structures | Robert Meagley, Kevin P. O'Brien, Michael Goodner, James M. Powers, Huey-Chiang Liou | 2013-08-20 |
| 8431223 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications | James C. Matayabas, Jr. | 2013-04-30 |
| 8242216 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications | James C. Matayabas, Jr. | 2012-08-14 |
| 7999042 | Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications | James C. Matayabas, Jr. | 2011-08-16 |
| 7718216 | Low temperature bumping process | Terry Sterrett, Saikumar Jayaraman | 2010-05-18 |
| 7619318 | No-flow underfill composition and method | Christopher L. Rumer, Vijay Wakharkar, Paul A. Koning | 2009-11-17 |
| 7521115 | Low temperature bumping process | Terry Sterrett, Saikumar Jayaraman | 2009-04-21 |
| 7504318 | Nanopowder coating for scribing and structures formed thereby | Daoqiang Lu, Eric J. Li | 2009-03-17 |
| 7470564 | Flip-chip system and method of making same | Song Shi | 2008-12-30 |
| 7303944 | Microelectronic devices having underfill materials with improved fluxing agents | Daoqiang Lu | 2007-12-04 |
| 7279359 | High performance amine based no-flow underfill materials for flip chip applications | Daoqiang Lu | 2007-10-09 |
| 7218007 | Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices | Song Shi, Jason Zhang, Katrina Certeza | 2007-05-15 |
| 7179684 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Song Shi, Lejun Wang | 2007-02-20 |
| 7153765 | Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles | Daoqiang Lu | 2006-12-26 |
| 7029723 | Forming chemical vapor depositable low dielectric constant layers | Robert Meagley, Kevin P. O'Brien, Michael Goodner, James M. Powers | 2006-04-18 |
| 7026376 | Fluxing agent for underfill materials | Daoqiang Lu | 2006-04-11 |
| 6982492 | No-flow underfill composition and method | Christopher L. Rumer, Vijay Wakharkar, Paul A. Koning | 2006-01-03 |
| 6899960 | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material | Song Shi, Lejun Wang | 2005-05-31 |
| 6872654 | Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric | Kevin P. O'Brien | 2005-03-29 |
| 6794225 | Surface treatment for microelectronic device substrate | Rahul N. Manepalli, Terry Sterrett, Vassoudevane Lebonheur | 2004-09-21 |
| 6794761 | No-flow underfill material | Song Shi | 2004-09-21 |
| 6780517 | Polycarbosilane adhesion promoters for low dielectric constant polymeric materials | Anna George, Kreistler S. Y. Lau, Hui-Jung Wu | 2004-08-24 |
| 6761975 | Polycarbosilane adhesion promoters for low dielectric constant polymeric materials | Anna George, Kreistler S. Y. Lau, Hui-Jung Wu | 2004-07-13 |
| 6730542 | Polybenzoxazine based wafer-level underfill material | Lejun Wang, Song Shi | 2004-05-04 |
| 6727594 | Polybenzoxazine based wafer-level underfill material | Lejun Wang, Song Shi | 2004-04-27 |