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Home › Intel › Tian-An Chen

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Tian-An Chen — 34 Patents

Intel: 23 patents #1,732 of 30,777Top 6%

Honeywell: 11 patents #1,040 of 16,504Top 7%

Duluth, GA: #19 of 860 inventorsTop 3%

Georgia: #606 of 35,610 inventorsTop 2%

Overall (All Time): #100,737 of 4,157,543Top 3%

34 Patents All Time

Tian-An Chen has been granted 34 US patents while listed as an inventor at Intel. The first was granted in 2000 and the most recent in August 2013. Tian-An Chen ranks #100,737 of 4,157,543 US inventors in our database (top 2.4%). Patent records list Tian-An Chen in Duluth, GA, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 34 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8513111	Forming semiconductor structures	Robert Meagley, Kevin P. O'Brien, Michael Goodner, James M. Powers, Huey-Chiang Liou	2013-08-20	$17,431,000
8431223	Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications	James C. Matayabas, Jr.	2013-04-30	$19,607,000
8242216	Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications	James C. Matayabas, Jr.	2012-08-14	$13,822,000
7999042	Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications	James C. Matayabas, Jr.	2011-08-16	$18,060,000
7718216	Low temperature bumping process	Terry Sterrett, Saikumar Jayaraman	2010-05-18	$11,091,000
7619318	No-flow underfill composition and method	Christopher L. Rumer, Vijay Wakharkar, Paul A. Koning	2009-11-17	$26,173,000
7521115	Low temperature bumping process	Terry Sterrett, Saikumar Jayaraman	2009-04-21	$22,748,000
7504318	Nanopowder coating for scribing and structures formed thereby	Daoqiang Lu, Eric J. Li	2009-03-17	$18,451,000
7470564	Flip-chip system and method of making same	Song Shi	2008-12-30	$13,967,000
7303944	Microelectronic devices having underfill materials with improved fluxing agents	Daoqiang Lu	2007-12-04	$21,616,000
7279359	High performance amine based no-flow underfill materials for flip chip applications	Daoqiang Lu	2007-10-09	$11,205,000
7218007	Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices	Song Shi, Jason Zhang, Katrina Certeza	2007-05-15	$17,522,000
7179684	Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material	Song Shi, Lejun Wang	2007-02-20	$9,940,000
7153765	Method of assembling soldered packages utilizing selective solder deposition by self-assembly of nano-sized solder particles	Daoqiang Lu	2006-12-26	$11,208,000
7029723	Forming chemical vapor depositable low dielectric constant layers	Robert Meagley, Kevin P. O'Brien, Michael Goodner, James M. Powers	2006-04-18	$13,047,000
7026376	Fluxing agent for underfill materials	Daoqiang Lu	2006-04-11	$16,494,000
6982492	No-flow underfill composition and method	Christopher L. Rumer, Vijay Wakharkar, Paul A. Koning	2006-01-03	$22,757,000
6899960	Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material	Song Shi, Lejun Wang	2005-05-31	$34,079,000
6872654	Method of fabricating a bismaleimide (BMI) ASA sacrifical material for an integrated circuit air gap dielectric	Kevin P. O'Brien	2005-03-29	$48,968,000
6794225	Surface treatment for microelectronic device substrate	Rahul N. Manepalli, Terry Sterrett, Vassoudevane Lebonheur	2004-09-21	$17,403,000
6794761	No-flow underfill material	Song Shi	2004-09-21	$17,403,000
6780517	Polycarbosilane adhesion promoters for low dielectric constant polymeric materials	Anna George, Kreistler S. Y. Lau, Hui-Jung Wu	2004-08-24	$13,822,000
6761975	Polycarbosilane adhesion promoters for low dielectric constant polymeric materials	Anna George, Kreistler S. Y. Lau, Hui-Jung Wu	2004-07-13	$21,583,000
6730542	Polybenzoxazine based wafer-level underfill material	Lejun Wang, Song Shi	2004-05-04	$23,705,000
6727594	Polybenzoxazine based wafer-level underfill material	Lejun Wang, Song Shi	2004-04-27	$48,199,000