| 12341281 |
Micro socket electrical couplings for dies |
Srikant Nekkanty, Debendra Mallik, Joe Walczyk, Feroz Mohammad |
2025-06-24 |
|
| 12088695 |
Systems and methods for device authentication in supply chain |
David Kehlet, Shuanghong Sun, Fariaz Karim |
2024-09-10 |
$16,964,000 |
| 11769753 |
Thermally-optimized tunable stack in cavity package-on-package |
George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Edvin Cetegen +1 more |
2023-09-26 |
$20,953,000 |
| 11456281 |
Architecture and processes to enable high capacity memory packages through memory die stacking |
Yi Li, Zhiguo Qian, Prasad Ramanathan, Kemal Aygun, Hector Amador +3 more |
2022-09-27 |
$23,391,000 |
| 10522450 |
Pillar based socket |
Gregorio R. Murtagian |
2019-12-31 |
$25,528,000 |
| 10115606 |
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby |
Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more |
2018-10-30 |
$31,457,000 |
| 9929080 |
Forming a stress compensation layer and structures formed thereby |
Daewoong Suh |
2018-03-27 |
$21,620,000 |
| 9859253 |
Integrated circuit package stack |
John S. Guzek, Yidnekachew S. Mekonnen |
2018-01-02 |
$11,729,000 |
| 9728515 |
Integrated WLUF and SOD process |
Rubayat Mahmud, Sriram Muthukumar |
2017-08-08 |
$11,912,000 |
| 9659889 |
Solder-on-die using water-soluble resist system and method |
Mihir A. Oka, Xavier Francois Brun, Dingying Xu, Edward R. Prack, Kabirkumar Mirpuri |
2017-05-23 |
$7,972,000 |
| 9646903 |
Thermoset polymides for microelectronic applications |
Stephen Lehman, James C. Matayabas, Jr. |
2017-05-09 |
$10,144,000 |
| 9472517 |
Dry-removable protective coatings |
Mihir A. Oka, Edward R. Prack, Dingying Xu |
2016-10-18 |
$9,528,000 |
| 9349698 |
Integrated WLUF and SOD process |
Rubayat Mahmud, Sriram Muthukumar |
2016-05-24 |
$13,693,000 |
| 9330993 |
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby |
Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more |
2016-05-03 |
$11,131,000 |
| 9247686 |
Polymer matrices for polymer solder hybrid materials |
Paul A. Koning, Ashay Dani |
2016-01-26 |
$9,792,000 |
| 8703286 |
Polymer matrices for polymer solder hybrid materials |
Paul A. Koning, Ashay Dani |
2014-04-22 |
$10,911,000 |
| 8643199 |
Thermoset polyimides for microelectronic applications |
Stephen Lehman, James C. Matayabas, Jr. |
2014-02-04 |
$11,338,000 |
| 8114948 |
Photosensitive compositions based on polycyclic polymers |
Edmund Elce, Takashi Hirano, Jeffrey C. Krotine, Larry F. Rhodes, Brian L. Goodall +2 more |
2012-02-14 |
|
| 8093105 |
Method of fabricating a capillary-flow underfill compositions |
Rahul N. Manepalli |
2012-01-10 |
$25,673,000 |
| 8053515 |
Directly photodefinable polymer compositions and methods thereof |
Edmund Elce, Andrew Bell, Brian Knapp, Hendra Ng, Larry F. Rhodes +8 more |
2011-11-08 |
|
| 7967942 |
Polymer matrices for polymer solder hybrid materials |
Paul A. Koning, Ashay Dani |
2011-06-28 |
$18,630,000 |
| 7948090 |
Capillary-flow underfill compositions, packages containing same, and systems containing same |
Rahul N. Manepalli |
2011-05-24 |
$35,173,000 |
| 7910674 |
Polymerized cycloolefins using transition metal catalyst and end products thereof |
Larry F. Rhodes, Andrew Bell, Ramakrishna Ravikiran, John C. Fondran, Brian L. Goodall +2 more |
2011-03-22 |
|
| 7851575 |
Polycyclic polymers containing pendant ion conducting moieties |
Ramakrishna Ravikiran, Xiaoming Wu, Larry F. Rhodes, Robert A. Shick, Hiroko Nakano +4 more |
2010-12-14 |
|
| 7846778 |
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
Christopher L. Rumer, Sabina J. Houle, Paul A. Koning, Ashay Dani |
2010-12-07 |
$26,454,000 |
