Issued Patents All Time
Showing 25 most recent of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341281 | Micro socket electrical couplings for dies | Srikant Nekkanty, Debendra Mallik, Joe Walczyk, Feroz Mohammad | 2025-06-24 |
| 12088695 | Systems and methods for device authentication in supply chain | David Kehlet, Shuanghong Sun, Fariaz Karim | 2024-09-10 |
| 11769753 | Thermally-optimized tunable stack in cavity package-on-package | George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Edvin Cetegen +1 more | 2023-09-26 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Zhiguo Qian, Prasad Ramanathan, Kemal Aygun, Hector Amador +3 more | 2022-09-27 |
| 10522450 | Pillar based socket | Gregorio R. Murtagian | 2019-12-31 |
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2018-10-30 |
| 9929080 | Forming a stress compensation layer and structures formed thereby | Daewoong Suh | 2018-03-27 |
| 9859253 | Integrated circuit package stack | John S. Guzek, Yidnekachew S. Mekonnen | 2018-01-02 |
| 9728515 | Integrated WLUF and SOD process | Rubayat Mahmud, Sriram Muthukumar | 2017-08-08 |
| 9659889 | Solder-on-die using water-soluble resist system and method | Mihir A. Oka, Xavier Francois Brun, Dingying Xu, Edward R. Prack, Kabirkumar Mirpuri | 2017-05-23 |
| 9646903 | Thermoset polymides for microelectronic applications | Stephen Lehman, James C. Matayabas, Jr. | 2017-05-09 |
| 9472517 | Dry-removable protective coatings | Mihir A. Oka, Edward R. Prack, Dingying Xu | 2016-10-18 |
| 9349698 | Integrated WLUF and SOD process | Rubayat Mahmud, Sriram Muthukumar | 2016-05-24 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2016-05-03 |
| 9247686 | Polymer matrices for polymer solder hybrid materials | Paul A. Koning, Ashay Dani | 2016-01-26 |
| 8703286 | Polymer matrices for polymer solder hybrid materials | Paul A. Koning, Ashay Dani | 2014-04-22 |
| 8643199 | Thermoset polyimides for microelectronic applications | Stephen Lehman, James C. Matayabas, Jr. | 2014-02-04 |
| 8114948 | Photosensitive compositions based on polycyclic polymers | Edmund Elce, Takashi Hirano, Jeffrey C. Krotine, Larry F. Rhodes, Brian L. Goodall +2 more | 2012-02-14 |
| 8093105 | Method of fabricating a capillary-flow underfill compositions | Rahul N. Manepalli | 2012-01-10 |
| 8053515 | Directly photodefinable polymer compositions and methods thereof | Edmund Elce, Andrew Bell, Brian Knapp, Hendra Ng, Larry F. Rhodes +8 more | 2011-11-08 |
| 7967942 | Polymer matrices for polymer solder hybrid materials | Paul A. Koning, Ashay Dani | 2011-06-28 |
| 7948090 | Capillary-flow underfill compositions, packages containing same, and systems containing same | Rahul N. Manepalli | 2011-05-24 |
| 7910674 | Polymerized cycloolefins using transition metal catalyst and end products thereof | Larry F. Rhodes, Andrew Bell, Ramakrishna Ravikiran, John C. Fondran, Brian L. Goodall +2 more | 2011-03-22 |
| 7851575 | Polycyclic polymers containing pendant ion conducting moieties | Ramakrishna Ravikiran, Xiaoming Wu, Larry F. Rhodes, Robert A. Shick, Hiroko Nakano +4 more | 2010-12-14 |
| 7846778 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Sabina J. Houle, Paul A. Koning, Ashay Dani | 2010-12-07 |