Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2023-10-03 | $24,984,000 |
| 11282717 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2022-03-22 | $16,833,000 |
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2018-10-30 | $31,457,000 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2016-05-03 | $11,131,000 |